SemiPulse | AI-Powered Semiconductor Supply Chain Intelligence & Market Signals

By Hwang Min-gyu Published 2026.05.26. 09:13 A concept diagram of iHBM technology released by SK hynix. /Courtesy of SK hynix SK hynix unveiled next-generation technology that reduces heat by inserting a cooling element inside a high bandwidth memory (HBM) package. On the 26th, SK hynix said it introduced "iHBM," a technology that embeds an integrated cooling element, ICE, in an HBM package. IC

SK hynix HBM Heat dissipation AI computing High bandwidth memory Chip packaging Thermal resistance 3D stacking

TSMC promises faster bonus growth in 2026 after employees threaten Samsung-style strike

0.95

digitimes.com 2026-05-26

Taiwan Semiconductor Manufacturing Company (TSMC) will reportedly cut employee bonuses by 15%, prompting some employees to voice dissatisfaction on social media. They argued that while TSMC's profits have soared, the share allocated to employee bonuses has decreased rather than increased, with some employees threatening to follow Samsung Electronics' union with a strike to fight for their rights.

China pushes homegrown AI stack with local chips, LLMs

0.92

digitimes.com 2026-05-26

Following the conclusion of the Trump-Xi meeting and amid continued delays in China approving imports of Nvidia H20 GPUs, China's National Development and Reform Commission (NDRC) on May 22 sent a strong policy signal on artificial intelligence (AI) self-sufficiency, explicitly calling for greater efforts to pair domestic large language models with domestically developed computing chips.

Wingtech sues Nexperia for US$1.2B as it fights delisting risk

0.92

digitimes.com 2026-05-26

Wingtech Technology, the Chinese tech company that owns Dutch semiconductor manufacturer Nexperia, has filed a civil lawsuit against Nexperia and five defendants for alleged damages worth CNY8 billion (approx. US$1.2 billion). The case is the latest development of the legal troubles between the Chinese company and its subsidiary following the Dutch government's seizure of the company in late 2025

Samsung's P4 HBM push could worsen DRAM crunch in 2027

0.95

digitimes.com 2026-05-26

Samsung Electronics is reportedly preparing to allocate much of its Pyeongtaek P4 cleanroom capacity to next-generation high-bandwidth memory (HBM) in 2027, a move that could tighten the supply of general-purpose DRAM as memory makers shift more production toward higher-value AI server products.

GlobalWafers rolls out phased GaN capacity expansion to ease supply crunch

0.95

digitimes.com 2026-05-26

Following GlobalWafers' shareholders' meeting on May 25, Chairperson Doris Hsu stated that the company's core compound semiconductor business, gallium nitride (GaN), is addressing strong demand for high-efficiency power solutions in AI servers. The company is also beginning to see emerging demand from diversified applications such as AI robotics. As a result, production capacity in 2026 has alread

This Billionaire Dumped Cloud Stocks for These New AI Stocks. Should Investors Follow Suit? - The Motley Fool

0.85

www.fool.com 2026-05-25 The Motley Fool

__fail__

After $2.5 billion Supermicro smuggling bust, Nvidia CEO urges company to fix export control compliance

0.92

tomshardware.com 2026-05-24 Luke James

Huang told reporters at Songshan Airport that Nvidia insists its partners follow U.S. trade rules.

NVIDIA Super Micro Export Compliance US Trade Controls AI Chips Taiwan Enforcement Chip Smuggling Semiconductor Supply Chain

Market expert Phil Rosen on ‘Nvidia dominance’ following tech giant’s earnings - qz.com

0.88

qz.com 2026-05-23 qz.com