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LG Electronics has entered the semiconductor packaging arena by signing a contract with an outsourced semiconductor assembly and test (OSAT) company to supply a maskless laser direct imaging (LDI) lithography tool. This technology enables the creation of metal interconnect patterns in chip packaging

LG Display has unveiled a significant innovation in OLED manufacturing called FLiPP (FMM-less Innovative Pixel Patterning), which replaces traditional metal masks with photolithography. This breakthrough enhances subpixel surface area, increasing panel brightness by 1.6x and lifespan by 2.4x, while