Semiconductor News & Analysis Feed

22600 articles
2026-05-27
www.digitimes.com 2026-05-27 digitimes
SK Hynix has unveiled a new high-bandwidth memory technology designed to reduce heat buildup in next-generation AI systems, as rising computing density turns thermal management into a more critical front for HBM suppliers. Some subscribers prefer to save their log-in information so they do not have to enter their User ID and Password each time they visit the site. To activate this
2026-05-27
www.digitimes.com 2026-05-27 digitimes
Samsung Electronics' 2026 tentative labor-management agreement is expected to pass after already surpassing an 86% voting participation rate within just three days. While the agreement has temporarily eased concerns over potential strikes, South Korea's... Some subscribers prefer to save their log-in information so they do not have to enter their User ID and Password each time they
2026-05-27
www.digitimes.com 2026-05-27 digitimes
Huawei's Tau Law proposal is rapidly redirecting attention across China's semiconductor industry away from pure lithography competition and toward advanced packaging, 3D stacking, optical interconnects, and system-level architecture design. Some subscribers prefer to save their log-in information so they do not have to enter their User ID and Password each time they visit the site.
2026-05-27
www.donga.com 2026-05-27 동아일보
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2026-05-27
aijourn.com 2026-05-27 The AI Journal
BILLERICA, Mass. & TOKYO–(BUSINESS WIRE)–Entegris, Inc. (Nasdaq: ENTG), a global leader in advanced materials and purity solutions for the semiconductor industry, and JSR Corporation, a materials innovation leader and the parent company of Inpria Corporation, today announced entry into a non-exclusive cross-licensing agreement aimed at helping the semiconductor industry advance extreme ultraviolet
2026-05-27
www.cnbc.com 2026-05-27 CNBC
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2026-05-27
www.manilatimes.net 2026-05-27 The Manila Times
~ Enabling Next-Generation Power Solutions ~ SHANGHAI, May 27, 2026 /PRNewswire/ -- USI, a global leader in electronic design and manufacturing services, today announced a breakthrough in advanced power semiconductor packaging technology designed for next-generation power solutions. Leveraging its innovative substrate and module integration capabilities, USI has successfully embedded silicon carb
2026-05-27
idahonews.com 2026-05-27 KBOI
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2026-05-27
idahonews.com 2026-05-27 KBOI
BOISE, Idaho (CBS2) — Boise-based Micron Technology has officially crossed into rare territory on Wall Street, briefly topping a $1 trillion market valuation Tuesday after another explosive rally in semiconductor stocks. Shares of Micron (NASDAQ: MU) surged nearly 20% during Tuesday trading, extending gains from the previous session as investors poured money into artificial intelligence-related c
2026-05-27
www.stocktitan.net 2026-05-27 Stock Titan
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2026-05-27
news.google.com 2026-05-27 Business Wire
2026-05-27
www.prnewswire.com 2026-05-27 PR Newswire
USI Showcases Advanced SiC Chip-Embedded Packaging Technology at PCIM Europe 2026 APAC - English NEWS PROVIDED BY USI 27 May, 2026, 07:00 CST SHARE THIS ARTICLE ~ Enabling Next-Generation Power Solutions ~ SHANGHAI, May 27, 2026 /PRNewswire/ -- USI, a global leader in electronic design and manufacturing services, today announced a breakthrough in advanced power semiconductor packaging
2026-05-27
www.idahopress.com 2026-05-27 Idaho Press
BOISE — Welcome to the trillion dollar club, Micron. Boise-headquartered Micron Technology’s stock price closed the trading day Tuesday up 19.29% to $895.88 per share, giving the semiconductor company a $1 trillion market cap. Do you LOVE local news? Get Local News Headlines in your inbox daily.   Yes!   Include special offer& contest announcement emails
2026-05-27
www.techspot.com 2026-05-27 TechSpot
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2026-05-27
www.thelec.net 2026-05-27 thelec.net
SK hynix unveils its iHBM technology with enhanced thermal dissipation performance on May 26. (Source: SK hynix) SK hynix on May 26 unveiled a new thermal management technology called "iHBM," designed to address heat generation issues in high-bandwidth memory (HBM) products operating at increasingly higher speeds. The key feature of iHBM is an integrated thermal control component called ICE, emb
2026-05-27
www.cnbc.com 2026-05-27 CNBC
CNBC’s Jim Cramer said Micron’s entry into the trillion-dollar club marks a turning point in the market. “We’re on the verge of a new era, where I think the trillion-dollar club may be a heck of a lot easier to join than in the old days, when the club excluded the riffraff,” the “Mad Money” host said. “AI has changed the order of things. No, it’s not being debased. It’s just become more inclusiv
2026-05-27
www.cnbc.com 2026-05-27 CNBC
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2026-05-27
www.upi.com 2026-05-27 upi.com
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2026-05-27
www.investmentnews.com 2026-05-27 InvestmentNews
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2026-05-27
www.fool.com 2026-05-27 The Motley Fool
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