Semiconductor News & Analysis Feed

19428 articles
2026-06-18
www.thelec.net 2026-06-18 thelec.net
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2026-06-18
news.futunn.com 2026-06-18 富途牛牛
Recently, domestic passenger vehicle ADAS domain controller chip installation data for April 2026 was released. According to statistics from NE Times New Energy, the total installation volume of ADAS domain controller chips in China’s passenger vehicle market reached 600,000 units in April. NVIDIA maintained its leading position with over 300,000 units installed, capturing a market share of 50.9%.
2026-06-18
finance.yahoo.com 2026-06-18 Yahoo Finance
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2026-06-18
smallcaps.com.au 2026-06-18 smallcaps.com.au
dorsaVi (ASX: DVL) has finalised the design package for its first integrated resistive random access memory-complementary metal-oxide semiconductor (RRAM-CMOS) validation chip. The company has developed the chip with NTU Singapore and ITRI Taiwan, and is now ready to move into tape-out and staged silicon implementation. The design incorporates self-checking write-and-verify circuitry, compute-in
2026-06-18
www.tradingview.com 2026-06-18 TradingView
News / Small Caps / dorsaVi Finalises RRAM-CMOS Validation Chip Design for Ultra-Edge AI dorsaVi Finalises RRAM-CMOS Validation Chip Design for Ultra-Edge AI 2 min read DVL 0 dorsaVi DVL has finalised the design package for its first integrated resistive random access memory-complementary metal-oxide semiconductor (RRAM-CMOS) validation chip. The company has developed the chip with NTU Singapo
2026-06-18
www.igorslab.de 2026-06-18 igor´sLAB
LATEST NEWS Qualcomm is reportedly considering a Tenstorrent acquisition for up to 10 billion dollars: Jim Keller’s AI and RISC-V company in focus 18. June 2026 06:00Samir Bashir 📖 Reading time: approx. 7 minutes · 1,294 words · 8,532 characters An acquisition worth up to ten billion US dollars is not an impulsive purchase between two board meetings, even in the semiconductor industry. Qualcomm i
2026-06-18
www.igorslab.de 2026-06-18 igor´sLAB
LATEST NEWS Qualcomm is reportedly considering a Tenstorrent acquisition for up to 10 billion dollars: Jim Keller’s AI and RISC-V company in focus 18. June 2026 06:00Samir Bashir 📖 Reading time: approx. 7 minutes · 1,294 words · 8,532 characters An acquisition worth up to ten billion US dollars is not an impulsive purchase between two board meetings, even in the semiconductor industry. Qualcomm i
2026-06-18
themachinemaker.com 2026-06-18 Machine Maker
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2026-06-18
scanx.trade 2026-06-18 scanx.trade
ScanX News Apple CEO Tim Cook Signals Price Hikes Amid Memory Chip Shortage Apple CEO Tim Cook Signals Price Hikes Amid Memory Chip Shortage 1 min read     Updated on 18 Jun 2026, 11:45 AM Reviewed by Naman S ScanX News Team Add as a preferred source on Google AI Summary Apple CEO Tim Cook has indicated that the company will raise product prices in response to a global memory chip shortage, which
2026-06-18
www.storyboard18.com 2026-06-18 Storyboard18
Apple is preparing to increase prices across its product portfolio as rising memory and storage chip costs put pressure on the company's margins, Chief Executive Officer Tim Cook said in an interview with The Wall Street Journal. The planned price increase comes as technology companies compete for limited supplies of memory components, with demand from AI-focused data centres pushing costs higher
2026-06-18
www.storyboard18.com 2026-06-18 Storyboard18
Apple is preparing to increase prices across its product portfolio as rising memory and storage chip costs put pressure on the company's margins, Chief Executive Officer Tim Cook said in an interview with The Wall Street Journal. The planned price increase comes as technology companies compete for limited supplies of memory components, with demand from AI-focused data centres pushing costs higher
2026-06-18
www.gadgets360.com 2026-06-18 Gadgets 360
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2026-06-18
ad5.stockfidelity.xyz 2026-06-18 newsline.com
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2026-06-18
mediaselangor.com 2026-06-18 mediaselangor.com
CUPERTINO, June 17 — Apple plans to raise prices on its products to offset increasing memory and storage chip costs, its chief executive officer Tim Cook told the Wall Street Journal (WSJ) in an interview. A surge in artificial intelligence (AI)-driven demand for data centres has forced consumer electronics companies into a fierce competition for dwindling supplies of the key components, driving
2026-06-18
www.ndtvprofit.com 2026-06-18 NDTV Profit
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2026-06-18
www.digitimes.com 2026-06-18 digitimes
As AI chip technology advances, larger chip sizes and heterogeneous integration packaging are driving bigger package dimensions, pushing semiconductor makers to adopt FOPLP over FOWLP and improve manufacturing efficiency by "replacing round with square."... Some subscribers prefer to save their log-in information so they do not have to enter their User ID and Password each time the
2026-06-18
www.tweaktown.com 2026-06-18 TweakTown
AMD, Google, Tesla, and Groq turn to Samsung Foundry as TSMC runs out of capacity TSMC's leading-edge capacity is locked up with NVIDIA, Apple, and Broadcom, making Samsung's available slots attractive despite trailing on yields. VIEW GALLERY - 3 Hassam Nasir Tech Reporter Published Jun 17, 2026 9:45 PM CDT 2 minutes & 15 seconds read time TL;DR: With TSMC's advanced chip production fully booked
2026-06-18
www.thefastmode.com 2026-06-18 The Fast Mode
HPE announced new innovations to help customers transform into agentic enterprises and move AI into production with greater security, governance, and control. These new offerings transform the HPE AI Factory with NVIDIA for the next era of AI where intelligence adapts, evolves, collaborates, and governs. Secure and governed agentic AI gives enterprises the controls needed to move agents from deve
2026-06-18
beth-kindig.medium.com 2026-06-18 Beth Kindig – Medium
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2026-06-18
kalkine.com.au 2026-06-18 Kalkine
Highlights dorsaVi shares rose 2.50% to AUD 0.041 on 18 June 2026, following the release of latest operational update. The company finalised the design package for its first integrated RRAM-CMOS validation chip. The chip was developed with NTU Singapore and ITRI Taiwan. The program now moves toward tape-out and staged silicon implementation. Key features include write-and-verify circuitry, Comput