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2026-05-28
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2026-05-28
Tom's Hardware
Tech Industry Manufacturing Semiconductors
Chinese university builds 3D chip design tool tailored to Huawei's ‘LogicFolding’ architecture — 3D design delivers increased performance and better thermal management
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By Luke James published 20 minutes ago
China now has a prototype tool designed for vertical circuit stacking.
(Image credit: Getty Images)
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2026-05-28
GuruFocus
For the complete transcript of the earnings call, please refer to the full earnings call transcript.
Q: Can you provide insights into the IP business and its growth prospects, especially after last year's weakness?
A: Sassine Ghazi, President and CEO, expressed confidence in the IP portfolio, highlighting its broad reach across various markets such as AI, HPC, and automotive. He emphasized the sh
2026-05-28
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2026-05-28
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2026-05-28
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2026-05-28
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digitimes.com
2026-05-28
Yageo, one of the world's largest passive component suppliers, said demand from AI-related applications has pushed its book-to-bill ratio to 1.3, surpassing levels seen at Japanese peers, including Murata, as tightening supply across the sector continues to extend lead times.
2026-05-28
digitimes.com
2026-05-28
UMC held its shareholders' meeting on May 27, with CEO Jason Wang saying that as AI applications expand rapidly, long-term semiconductor demand still has room for growth. In addition to deepening its strengths in mature and specialty processes, UMC is also advancing next-generation technologies, including a US-based 12nm FinFET platform, advanced packaging, and silicon photonics, to prepare for fu
2026-05-28
digitimes.com
2026-05-28
Marvell Technology has said its custom silicon business and data center solutions are emerging as central pillars of its long-term growth strategy, driven by rising demand from hyperscale cloud customers building AI infrastructure, including XPUs, Ethernet switching systems, and high-speed optical interconnects.