Semiconductor News & Analysis Feed
184 articles
2026-05-30
digitimes.com
2026-05-30
India has signed a memorandum of understanding (MoU) with Intel and US-based 3DGS to establish an advanced packaging glass-core substrate manufacturing facility in the eastern state of Odisha, marking Intel's first significant participation in India's semiconductor manufacturing ecosystem beyond its existing design and technology operations.
2026-05-30
www.digitimes.com
2026-05-30
digitimes
India has signed a memorandum of understanding (MoU) with Intel and US-based 3DGS to establish an advanced packaging glass-core substrate manufacturing facility in the eastern state of Odisha, marking Intel's first significant participation in India's...
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2026-05-30
www.upi.com
2026-05-30
upi.com
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2026-05-29
www.chosun.com
2026-05-29
조선일보
By Seongmin K
Published 2026.05.30. 00:45
Samsung Electronics announced on the 29th that it had supplied samples of its 7th-generation high-bandwidth memory (HBM4E) with 12 layers to customers, a world first. HBM is an essential memory semiconductor used in AI accelerators and data centers for AI. Following its February announcement as the first in the semiconductor industry to begin mass produc
2026-05-29
www.cleanroomtechnology.com
2026-05-29
Cleanroom Technology
A partnership has been established between ASML and Tata Electronics to create India’s first 30mm semiconductor fabrication facility.
Under the memorandum of understanding (MoU), ASML will deploy its lithography platforms and associated solutions to support operations at Tata Electronics’ upcoming Dholera facility.
ASML is a Netherlands-based global semiconductor equipment manufacturer special
2026-05-29
www.semiconductor-today.com
2026-05-29
Semiconductor Today
Infineon introduces first silicon carbide power module operating at 205°C
Infineon Technologies AG of Munich, Germany is introducing a new 1300V silicon carbide (SiC) module within the HybridPACK Drive family that is capable of continuous operation at temperatures up to 205°C. Existing designs typically allow up to 175°C. This increase enables automotive OEMs and tier-1 suppliers to deliver highe
2026-05-29
tomshardware.com
2026-05-29
Jake Roach
Acer has two new gaming laptops for Computex, including its first laptop with the Ryzen 9 9955HX3D CPU, and a device that sports triple PCIe 5.0 storage.
2026-05-29
www.newelectronics.co.uk
2026-05-29
New Electronics
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Neil Tyler
29 May 2026
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Infineon introduces first silicon carbide power module o
2026-05-29
www.automotiveworld.com
2026-05-29
Automotive World
Infineon has introduced a 1300 V SiC power module operating at 205°C, 30 degrees above the industry standard, for EV inverter use
May 29, 2026
Infineon Technologies has introduced a 1300 V silicon carbide (SiC) power module for electric vehicle (EV) inverters, the first within its HybridPACK Drive family capable of continuous operation at 205°C, a 30°C increase over the 175°C industry standard.
2026-05-29
digitimes.com
2026-05-29
Samsung Electronics has started shipping samples of its latest high-bandwidth memory (HBM) chip, the 12-layer HBM4E, marking the industry's first delivery of the next-generation AI memory product, according to the company. The move underscores intensifying competition among memory suppliers as demand accelerates for higher-performance components used in AI computing systems.
2026-05-29
digitimes.com
2026-05-29
As the global buildout of artificial intelligence infrastructure accelerates, Taiwan's technology industry has emerged as one of the most closely watched hubs in the world. Ahead of COMPUTEX 2026, Morgan Stanley held its Asia AI Summit in Taipei for the first time, underscoring the island's central role in the global semiconductor supply chain and the AI investment cycle.
2026-05-29
news.samsung.com
2026-05-29
samsung.com
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2026-05-29
news.google.com
2026-05-29
Business Wire
2026-05-29
tomshardware.com
2026-05-29
Brandon Hill
TP-Link announced today the roadmap for its next-generation platform of Wi-Fi 8 (802.11bn) products.
2026-05-28
blogs.nvidia.com
2026-05-28
NVIDIA Blog
The Name’s Gaming … Cloud Gaming: ‘007 First Light’ Launches on GeForce NOW
Step into James Bond’s origin story with an Ultimate membership bundle offer and reward — plus eight new games in the cloud.
May 28, 2026 by GeForce NOW Community
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License to stream, shaken and stirred.
GeForce NOW is dialing up the espionage with the launch of 007 First Light, letting members slip into James Bo
2026-05-28
news.google.com
2026-05-28
NVIDIA Blog
2026-05-28
tomshardware.com
2026-05-28
Matt Safford
The first Snapdragon C-powered laptop, the Aspire Go 15, delivers 512GB of storage and 8GB of RAM, plus a good collection of ports for a still-undisclosed ‘entry-tier price point.’
2026-05-28
asia.nikkei.com
2026-05-28
Nikkei Asia
Acer, HP and Lenovo on board for affordable laptops as component prices rise
Qualcomm's Snapdragon C Platform chips are aimed at entry-level laptops priced around $300, a bet by the U.S. chipmaker that lower-cost AI PCs will catch on. (Qualcomm)
TAIPEI -- Qualcomm Technologies is launching its first chip for budget PCs, as computer makers struggle with surging prices of CPUs and memory chips due
2026-05-28
digitimes.com
2026-05-28
On May 27, Marvell Technology reported record revenue in the fiscal first quarter of 2027 and raised its long-term outlook, citing accelerating demand for AI-related data center infrastructure, particularly in high-speed interconnect, Ethernet switching, and custom silicon solutions used in hyperscale cloud deployments.
2026-05-28
digitimes.com
2026-05-28
Qualcomm has reportedly landed more than one ASIC customer, with a separate project for a US cloud service provider also taking shape, according to industry sources. The development follows reports from Bloombergand other media that ByteDance, the developer of TikTok, is Qualcomm's first major client for its custom chip push.