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LG Chem has begun supplying semiconductor strippers to Amkor Technology, a major US-based packaging and testing provider, in its first commercial move into the market. The deal highlights rising demand for advanced chip-making chemicals as artificial intelligence, high-bandwidth memory, and smaller device designs reshape global semiconductor manufacturing.

China TPU chipmaker Zhonghao Xinying launches Xuyu AI processor to challenge GPU-based computing

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digitimes.com 2026-07-06

Zhonghao Xinying (Hangzhou) Technology has launched its new self-developed high-performance TPU AI processor, Xuyu, alongside Taize 2.0, a software-hardware integrated AI computing platform built around the chip.

Asahi Kasei to expand Taiwan photoresist film capacity for AI chip packaging

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digitimes.com 2026-07-06

Asahi Kasei, one of the notable suppliers of Sunfort dry film photoresist in Japan, has initiated a fab expansion project in Taiwan. The newly established plant is expected to further elevate capacity performance in cutting and processing semiconductor packaging substrates.

Greatek Electronics advances Taiwan+1 plan with acquisition of Onsemi Philippines packaging plant

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digitimes.com 2026-07-06

Greatek Electronics, a subsidiary of memory packaging and testing provider Powertech Technology (PTI), has approved the acquisition of On Semiconductor SSMP Philippines, a packaging and testing services company under the On Semiconductor (Onsemi) group, using internal funds. The acquisition aims to strengthen the group's overseas operational footprint and improve its global customer service capabi

Jim Keller startup Fab2 targets small-fab mass production

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digitimes.com 2026-07-06

Atomic Semi, the semiconductor equipment startup founded by chip architect Jim Keller, has rebranded as Fab2 and moved its headquarters to Austin, Texas, with a vision of mass-producing small fabs. According to Tom's Hardware, Fab2's core idea is a "fab fab": it designs and builds all of its own equipment, from pumps, valves, and gas lines to lithography tools and vacuum chambers, then assembles t

Exclusive Interview: Dutch startup Nearfield targets AI chip process control expansion after US$380 million funding round

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digitimes.com 2026-07-06

Dutch semiconductor equipment startup Nearfield Instruments has completed a US$380 million Series D funding round, the largest-ever fundraising for a Dutch deep-tech company. The company is now targeting an initial public offering (IPO) in 2028.

Samsung, SK Hynix and Micron face HBM4 race as custom chip demand grows

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digitimes.com 2026-07-06

The global high-bandwidth memory market is expected to pivot from HBM3E to HBM4 in the second half of 2026, setting up a sharper contest for market share among Samsung Electronics, SK Hynix, and Micron Technology.

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