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Samsung's silicon photonics push adds new layer to Korea-Dutch chip ties

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digitimes.com 2026-05-26

South Korea and the Netherlands are looking to broaden their semiconductor partnership beyond ASML's EUV lithography machines, as silicon photonics (SiPh) emerges as a potential next field of cooperation amid rising power and bandwidth demands from AI data centers.

Intel's Rio Rancho fab becomes test case for AI-era chip packaging

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digitimes.com 2026-05-26

Intel is looking to broaden its foundry strategy beyond the race for advanced process nodes, placing greater emphasis on advanced packaging and glass substrate technologies as it positions Rio Rancho — its New Mexico site — as a global hub for next-generation packaging production.

Chiplet boom puts Taiwan's InPsytech and its AI connectivity IPs in the spotlight

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digitimes.com 2026-05-26

As the global semiconductor industry pivots toward chiplet-based designs — where multiple smaller chips are packaged together rather than built as a single monolithic die — the specialized intellectual property that makes those chips communicate reliably has become critical infrastructure. InPsytech, a Taiwanese IP design firm and subsidiary of Egis Technology, has staked its business on exactly t

China pushes homegrown AI stack with local chips, LLMs

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digitimes.com 2026-05-26

Following the conclusion of the Trump-Xi meeting and amid continued delays in China approving imports of Nvidia H20 GPUs, China's National Development and Reform Commission (NDRC) on May 22 sent a strong policy signal on artificial intelligence (AI) self-sufficiency, explicitly calling for greater efforts to pair domestic large language models with domestically developed computing chips.

Wingtech sues Nexperia for US$1.2B as it fights delisting risk

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digitimes.com 2026-05-26

Wingtech Technology, the Chinese tech company that owns Dutch semiconductor manufacturer Nexperia, has filed a civil lawsuit against Nexperia and five defendants for alleged damages worth CNY8 billion (approx. US$1.2 billion). The case is the latest development of the legal troubles between the Chinese company and its subsidiary following the Dutch government's seizure of the company in late 2025

Micron expands US DDR4 output as AI keeps global supply tight

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digitimes.com 2026-05-26

As Micron Technology's decision to restart large-scale DDR4 production in the US grabs global attention, memory-chip executives and analysts say the move is less a revival of aging technology than a strategic reshuffling of supply aimed at safeguarding critical American industries.

Samsung's reported 900-layer V-NAND prototype puts NAND race with YMTC in focus

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digitimes.com 2026-05-26

The race to dominate next-generation NAND flash memory has long been measured in layers — and Samsung Electronics appears to be pulling ahead. The South Korean chipmaker has reportedly developed a 900-layer-class V-NAND prototype, a significant leap that brings the memory industry closer to the 1,000-layer threshold as chipmakers intensify efforts to pack more storage into smaller chips while cutt

Alchip: ASIC growth may outpace the broader GPU market

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digitimes.com 2026-05-26

For the past three years, graphics processing units, or GPUs, have dominated the artificial intelligence boom. But Johnny Shen, chairman of Alchip Technologies, believes the next phase of the market may belong to something more specialized.

Semiconductor Industry AI Chips GPU Market ASIC Chips Artificial Intelligence Chip Design Market Trends Technology Development

Wiwynn expands US capacity as AI server boom strains power and supply chains

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digitimes.com 2026-05-26

Taiwan-based AI server maker Wiwynn is accelerating its global expansion as surging demand for AI infrastructure creates mounting pressure on power supply, production capacity, and critical component availability.

Kioxia targets 2027 BiCS 10 NAND production as Samsung, SK Hynix hold back investment

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digitimes.com 2026-05-26

Kioxia is targeting 2027 production of its 10th-generation BiCS 10 NAND, a move that could help the Japanese memory maker narrow its technology gap with Samsung Electronics and SK Hynix as the South Korean rivals delay investment in their own next-generation NAND technologies, according to ZDNet Korea.

Powerchip unveils 3D AI Foundry with 3D WoW DRAM stacking at COMPUTEX 2026

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digitimes.com 2026-05-26

Powerchip announced it will present a "3D AI Foundry" showcase at COMPUTEX 2026 to demonstrate 3D wafer-on-wafer (WoW) DRAM stacking, interposers, and Si-cap integrated passive devices as part of an end-to-end offering for AI chips, addressing rising demand for GenAI and high-performance computing for memory capacity, bandwidth, and energy efficiency. The firm said it is leveraging its combined lo

Samsung's P4 HBM push could worsen DRAM crunch in 2027

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digitimes.com 2026-05-26

Samsung Electronics is reportedly preparing to allocate much of its Pyeongtaek P4 cleanroom capacity to next-generation high-bandwidth memory (HBM) in 2027, a move that could tighten the supply of general-purpose DRAM as memory makers shift more production toward higher-value AI server products.

Here’s Why Micron (MU) is Among the 15 High Growth Stocks to Buy and Hold for the Next Decade - Yahoo Finance

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finance.yahoo.com 2026-05-26 Yahoo Finance

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Here’s Why Micron (MU) is Among the 15 High Growth Stocks to Buy and Hold for the Next Decade - Yahoo! Finance Canada

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ca.finance.yahoo.com 2026-05-26 Yahoo! Finance Canada

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The 'Next Nvidia' Trade? Why Investors Are Suddenly Watching Advanced Micro Devices, Arm Holdings, and Marvell Technology - The Globe and Mail

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