Semiconductor News & Analysis Feed
209 articles
2026-05-25
www.japantimes.co.jp
2026-05-25
The Japan Times
SHANGHAI/BEIJING –
Huawei Technologies said on Monday its high-end chips will have transistor density equivalent to 1.4-nanometer processes in five years, underscoring Beijing’s efforts to neutralize U.S. sanctions that have made it hard for China to build advanced chips.
Huawei did not provide independent performance data, but the target, unveiled at a semiconductor symposium in Shanghai, is
2026-05-25
stratnewsglobal.com
2026-05-25
StratNews Global
Home Asia Huawei Unveils New Chip Design Amid Semiconductor Push
Huawei Unveils New Chip Design Amid Semiconductor Push
By Team StratNews - May 25, 2026
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Huawei Technologies said on Monday that its advanced chips are expected to achieve transistor densities comparable to 1.4-nanometre process technology within the next five years
2026-05-25
www.huaweicentral.com
2026-05-25
Huawei Central
HUAWEI
Huawei Kirin 2026 Chip: 238 MTr/mm2 transistor density rivaling TSMC’s 3nm
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May 25, 2026
By
Deng Li
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Huawei has revealed its Kirin 2026 details and it reveals massive upgrade in the chip arachitecture including transistor density.
He Tingbo, Director and President of Semiconductor B
2026-05-25
www.cnbc.com
2026-05-25
CNBC
SHANGHAI — Chinese tech giant Huawei on Monday touted a new approach to developing advanced semiconductors despite U.S. sanctions, as Nvidia
struggles to sell its high-end chips in China.
Huawei said it developed a new engineering approach called “LogicFolding” to manufacture its Kirin smartphone chips this fall.
That breakthrough comes as Nvidia
faces U.S. export restrictions in China and App
2026-05-25
news.futunn.com
2026-05-25
富途牛牛
① The Tao (τ) Law proposes replacing “geometric scaling” with “time (τ) scaling” as the new guiding principle for the evolution of semiconductors and electronic systems. ② Based on the Tao (τ) Law, Huawei has already designed and mass-produced 381 chip models. The Kirin chip, set to debut in the fall of 2026, will be the first to adopt Logic Folding technology.
According to a report by The Scienc
2026-05-25
www.investing.com
2026-05-25
Investing.com
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2026-05-25
startupfortune.com
2026-05-25
Startup Fortune
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Huawei says its chip plan can narrow the gap with TSMC
Huawei says its chip plan can narrow the gap with TSMC
AI / BUSINESS | Huawei says it expects to design high-end chips by 2031 with transistor density equivalent to 1.4-nanometre manufacturing. The claim does not erase TSMC's lead, but it gives China's AI hardware push a clearer roadmap and adds pressure to Nvidia's China strategy
2026-05-25
www.devdiscourse.com
2026-05-25
Devdiscourse
UPDATE 2-China's Huawei reveals chip design breakthrough amid US sanctions
Huawei's Ascend chip series has become increasingly central to powering Chinese AI models, including DeepSeek's latest flagship model V4, released last month. Huawei said its Kirin chips scheduled to launch later this year would be the first to use a related architecture called LogicFolding, which the company said would
2026-05-25
www.techinasia.com
2026-05-25
Tech in Asia
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2026-05-25
www.businesstimes.com.sg
2026-05-25
The Business Times
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2026-05-25
www.businesstimes.com.sg
2026-05-25
The Business Times
China’s Huawei reveals chip design breakthrough amid US sanctions
The company’s Ascend chip series has become increasingly central to powering Chinese artificial intelligence models
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Published Mon, May 25, 2026 · 10:10 AM — Updated Mon, May 25, 2026 · 01:24 PM
Huawei unveiled on Monday a new principle for improving chips, noting the industry can no l
2026-05-25
www.globaltimes.cn
2026-05-25
Global Times
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2026-05-25
www.tradingview.com
2026-05-25
TradingView
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2026-05-25
theedgemalaysia.com
2026-05-25
The Edge Malaysia
(May 25): Huawei Technologies Co said it has come up with a new pathway to shorten its gap with industry leader Taiwan Semiconductor Manufacturing Co (TSMC), potentially achieving a breakthrough in making advanced semiconductors without cutting-edge equipment.
Right now there is about a five-year gap between what TSMC is capable of and what Huawei together with its manufacturing partner Semicondu
2026-05-25
www.reuters.com
2026-05-25
Reuters
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2026-05-25
www.marketscreener.com
2026-05-25
marketscreener.com
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2026-05-25
www.scmp.com
2026-05-25
South China Morning Post
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2026-05-25
www.scmp.com
2026-05-25
South China Morning Post
Huawei
Tech
Huawei unveils new scaling law and tech that narrows gap with TSMC, Samsung
The Chinese tech giant’s new breakthrough is a major milestone in its mission to create a self-reliant semiconductor ecosystem
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Ann Caoin ShanghaiandIris Dengin Shenzhen
Published: 9:30am, 25 May 2026Updated: 11:33am, 25 May 2026
Huawei Technologies has unveil
2026-05-25
www.bloomberg.com
2026-05-25
Bloomberg.com
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2026-05-25
www.bloomberg.com
2026-05-25
Bloomberg.com
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