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Advanced Packaging12 GPU9 AI8 HBM8 EDA7 AI Chips6 Chiplet4 2.5D/3D Packaging4 DRAM4 Data Center Infrastructure4 2.5D Packaging3 AI Compute3
2026-09-14
Infineon RISC-V for Automotive at Hot Chips 2026 - ServeTheHome
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www.servethehome.com 2026-09-14
2026-09-08
From One GPU to an AI Factory: Deep Dive into NVIDIA’s Six Hot Chips 2026 Presentations - semivision
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tspasemiconductor.substack.com 2026-09-08
2026-09-08
From One GPU to an AI Factory: Deep Dive into NVIDIA’s Six Hot Chips 2026 Presentations - semivision
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tspasemiconductor.substack.com 2026-09-08
2026-09-08
Canonical Evolution of Enterprise Open Source RISC-V at Hot Chips 2026 - servethehome.com
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www.servethehome.com 2026-09-08
2026-09-06
Hot Chips 2026: HBM Base Die Evolves from a Memory Interface into a Computing Engine — Samsung Unveils a Three-Phase Roadmap Toward Custom HBM, aHBM, and zHBM - semivision
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tspasemiconductor.substack.com 2026-09-06
2026-09-03
Update on RISC-V Standards and Adoption at Hot Chips 2026 - servethehome.com
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www.servethehome.com 2026-09-03
2026-09-02
NVIDIA RISC-V for NVIDIA GPUs at Hot Chips 2026 - ServeTheHome
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www.servethehome.com 2026-09-02
2026-08-27
Hot Chips 2026: The Memory Wall Is Making Hybrid Bonding a Necessity - semivision
0.92
tspasemiconductor.substack.com 2026-08-27
2026-08-27
Hot Chips 2026: The Memory Wall Is Making Hybrid Bonding a Necessity - semivision
0.92
tspasemiconductor.substack.com 2026-08-27
2026-08-26
Hot Chips 2026: High Bandwidth Flash promises massive bandwidth and capacity, but its usability is extremely limited - Tom's Hardware
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www.tomshardware.com 2026-08-26
At Hot Chips 2026, GPU IP company OXMIQ Labs revealed the limitations of High Bandwidth Flash (HBF). While HBF offers significantly higher memory capacity than traditional High Bandwidth Memory (HBM), its bandwidth performance lags behind, making it unsuitable for most AI workloads. HBF uses 3D NAND
High Bandwidth FlashHBFHigh Bandwidth MemoryHBMGPUAI Accelerator3D NANDUCIe Interface
2026-08-26
Hot Chips 2026: Arm details AGI server CPU with two 70-core N3P chiplets — touts 2 TB/s UCIe fabric link and 12-channel memory controller - Tom's Hardware
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www.tomshardware.com 2026-08-26
2026-08-26
Samsung, SK hynix Clash Over Next-Gen AI Memory at ‘Hot Chips 2026’ - Businesskorea
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www.businesskorea.co.kr 2026-08-26
2026-08-26
Hot Chips 2026: Samsung advances LPDDR5X-PIM as HBM costs mount - digitimes
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www.digitimes.com 2026-08-26
2026-08-26
Google TPUv8 Hot Chips 2026 Inference Needs More HBM Bandwidth - ServeTheHome
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www.servethehome.com 2026-08-26
2026-08-26
Hot Chips 2026: Samsung advances LPDDR5X-PIM as HBM costs mount
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digitimes.com 2026-08-26
2026-08-26
NVIDIA’s Groq 3 LPU Accelerators for Heterogeneous AI Compute at Hot Chips 2026 - ServeTheHome
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www.servethehome.com 2026-08-26
2026-08-26
NVIDIA Spectrum-X Ethernet Multiplane Network Architecture at Hot Chips 2026 - ServeTheHome
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www.servethehome.com 2026-08-26
2026-08-26
NVIDIA BlueField-4 Processor at Hot Chips 2026 - ServeTheHome
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www.servethehome.com 2026-08-26
2026-08-25
Hot Chips 2026: Micron says the silicon gap between HBM and DDR5 is widening with every generation - Tom's Hardware
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www.tomshardware.com 2026-08-25
2026-08-25
Hot Chips 2026: Nvidia breaks down 88-core Vera CPU
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tomshardware.com 2026-08-25
At Hot Chips 2026, NVIDIA unveiled detailed technical insights into its next-generation Vera CPU, designed for agentic AI data centers. Vera is NVIDIA's first custom CPU core, following the Grace CPU that used a stock Arm design. Featuring 88 cores based on the Olympus core architecture, Vera introd
NVIDIAVera CPUAgentic AICPU ArchitectureSpatial MultithreadingLPDDR5XOlympus CoreData Center CPU