Semiconductor News & Analysis Feed

2 articles
2026-06-19
wccftech.com 2026-06-19 Wccftech
Imitation remains the highest form of flattery. After Samsung won plaudits for the Exynos 2600's novel Heat Path Block (HPB) thermal technology, Qualcomm, whose recent chips iterations have resembled a veritable inferno when it comes to their runaway heat issues, now appears to be flattering Samsung by copying its HPB tech for the upcoming Snapdragon 8 Elite Gen 6 Pro, albeit sloppily so.
2026-06-03
tomshardware.com 2026-06-03 Luke James
Samsung displayed its first physical mockup of HBM5 memory at Computex 2026 in Taipei, pairing the eighth-generation AI memory with a new in-package cooling structure.