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2026-05-28
HP Cuts Full-Year Outlook Despite Higher Second-Quarter Profit, Revenue - WSJ
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www.wsj.com 2026-05-28 WSJ
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2026-05-27
Thermal Management Becomes Primary Constraint in HPC and AI Accelerator Packaging - IndexBox
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www.indexbox.io 2026-05-27 IndexBox
Thermal management has become the primary limiting factor in high-performance computing and AI accelerator packaging. Contemporary packages combine high-power ASICs with multiple High Bandwidth Memory stacks on a silicon interposer, resulting in closely linked thermal and mechanical interactions. Thermal crosstalk between dies increases HBM junction temperatures, while mismatched coefficients of t
Thermal ManagementHigh-Performance ComputingAI AcceleratorSemiconductor PackagingSilicon InterposerHigh Bandwidth MemoryThermal CrosstalkThermo-Mechanical Stress
2026-05-27
Daxin Materials advances into Low Dk and Low Df market for booming AI server and LEO satellite applications
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digitimes.com 2026-05-27
Taiwan-based Daxin Materials posted stronger revenue and profitability in 2025 as rapid growth in semiconductor materials offset a still-cautious display market recovery, with AI- and HPC-driven demand emerging as the company's primary growth engine.
2026-05-26
NVIDIA "Vera" CPU Benchmarked: Beating Intel Xeon and AMD EPYC in Select Workloads - TechPowerUp
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www.techpowerup.com 2026-05-26 TechPowerUp
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NVIDIACPU BenchmarkSemiconductorServer ProcessorComputing PerformanceTechnology BenchmarkIntel XeonAMD EPYC
2026-05-26
NVIDIA GeForce Graphics Drivers 610.47 WHQL Drops Control Panel Support - TechPowerUp
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news.google.com 2026-05-26 TechPowerUp
2026-05-26
Analysts Have Conflicting Sentiments on These Technology Companies: HP (HPQ) and Nvidia (NVDA) - The Globe and Mail
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www.theglobeandmail.com 2026-05-26 The Globe and Mail
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2026-05-26
SK hynix Unveils iHBM Thermal Solution to Boost AI Performance - TechPowerUp
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www.techpowerup.com 2026-05-26 TechPowerUp
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SemiconductorMemory ChipAI ComputingStorage TechnologyChip ManufacturingSK HynixArtificial IntelligenceMemory Architecture
2026-05-25
AMD "Zen 7" IP to Use TSMC A14 Node and More Advanced Packaging - TechPowerUp
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www.techpowerup.com 2026-05-25 TechPowerUp
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2026-05-25
AMD "Zen 7" IP to Use TSMC A14 Node and More Advanced Packaging - TechPowerUp
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www.techpowerup.com 2026-05-25 TechPowerUp
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AMDTSMCZen 7A14 nodeAdvanced packagingCPU architectureSemiconductor manufacturingChip design
2026-05-24
NVIDIA AI Releases Gated DeltaNet-2: A Linear Attention Layer That Decouples Erase and Write in the Delta Rule - MarkTechPost
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www.marktechpost.com 2026-05-24 MarkTechPost
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2026-05-23
Top Research Reports for Texas Instruments, Linde & BHP - Yahoo Finance Singapore
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news.google.com 2026-05-23 Yahoo Finance Singapore
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2026-05-23
Top Research Reports for Texas Instruments, Linde & BHP - Yahoo Finance
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news.google.com 2026-05-23 Yahoo Finance
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2026-05-23
Top Research Reports for Texas Instruments, Linde & BHP - Zacks Investment Research
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news.google.com 2026-05-23 Zacks Investment Research
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2026-05-23
Micron Advances Made-in-America Memory with Manufacturing Expansion in Virginia - HPCwire
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www.hpcwire.com 2026-05-23 HPCwire
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2026-05-22
Micron Advances Made-in-America Memory With Manufacturing Expansion in Virginia - TechPowerUp
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www.techpowerup.com 2026-05-22 TechPowerUp
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MicronSemiconductor ManufacturingDomestic ProductionMemory ChipsVirginia FacilitySemiconductor IndustryChip FabricationUS Semiconductor
2026-05-22
Micron Advances Made-in-America Memory With Manufacturing Expansion in Virginia - TechPowerUp
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www.techpowerup.com 2026-05-22 TechPowerUp
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2026-05-21
AMD’s EPYC Venice Becomes Industry’s First 2nm HPC CPU To Achieve Volume Ramp As It Races Towards Agentic AI Leadership - Wccftech
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wccftech.com 2026-05-21 Wccftech
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2026-05-21
D-Wave Signs LOI for $100M CHIPS Act Funding to Advance Quantum Systems - HPCwire
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news.google.com 2026-05-21 HPCwire
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2026-05-21
Fraunhofer IPMS Develops High-Density Chiplet Systems at the Wafer Level - TechPowerUp
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www.techpowerup.com 2026-05-21 TechPowerUp
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2026-05-21
AMD Announces Production Ramp of Next-Generation AMD EPYC Processor "Venice" on TSMC 2nm Process Technology - TechPowerUp
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www.techpowerup.com 2026-05-21 TechPowerUp
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