Semiconductor News & Analysis Feed

At the 2026 IEEE Electronic Components and Technology Conference (ECTC), Intel showcased its next-generation advanced packaging technology, EMIB-T, which marks a significant breakthrough in AI and High-Performance Computing (HPC) applications. By integrating silicon interposers with through-silicon

SK Hynix has begun shipping its next-generation HBM4E high-bandwidth memory (HBM) to AI customers, marking a significant step in its strategy for data center and high-performance computing markets. The new HBM4E chips offer enhanced data processing speed, capacity, and heat resistance compared to pr