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2026-06-18
letsdatascience.com
2026-06-18
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SK hynix Ships 12-Layer HBM4E Samples to Customers
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June 17, 2026
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SK hynix announced it has shipped samples of its 12-layer HBM4E high-bandwidth memory to major customers, according to a PR Newswire release carried by Manila Times, Morningstar and ot
2026-06-18
www.prnewswire.com
2026-06-18
PR Newswire
SK hynix Ships Samples of 12-Layer Next-Gen 'HBM4E'
NEWS PROVIDED BY
SK hynix Inc.
Jun 17, 2026, 19:35 ET
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- Delivers 12-high HBM4E samples to major customers
- Achieves a maximum speed of 16Gbps per pin with improvements in both performance and efficiency
- Utilizes Advanced MR-MUF, reducing heat resistance by 17% while improving stability
- SK hynix st
2026-06-18
finance.yahoo.com
2026-06-18
Yahoo Finance
This is a paid press release. Contact the press release distributor directly with any inquiries.
SK hynix Ships Samples of 12-Layer Next-Gen 'HBM4E'
PR Newswire
Wed, June 17, 2026 at 4:35 PM PDT 3 min read
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- Delivers 12-high HBM4E samples to major customers
- Achieves a maximum speed of 16Gbps per pin with improvements in both performance and efficiency
- Utilizes Advanced MR-MUF
2026-06-18
www.morningstar.com
2026-06-18
Morningstar
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PR Newswire
SK hynix Ships Samples of 12-Layer Next-Gen 'HBM4E'
SK hynix Ships Samples of 12-Layer Next-Gen 'HBM4E'
Provided by PR Newswire Jun 18, 2026, 7:35:00 AM
SK hynix Ships Samples of 12-Layer Next-Gen 'HBM4E'
SK hynix Ships Samples of 12-Layer Next-Gen 'HBM4E'
PR Newswire
SEOUL, South Korea, June 17, 2026
- Delivers 12-high HBM4E samples to major customers
- Achieves
2026-06-18
finance.yahoo.com
2026-06-18
Yahoo Finance
Nvidia supplier SK Hynix ships samples of next-generation chips to major customers
Illustration shows SK HYNIX logo · Reuters
Reuters
Wed, June 17, 2026 at 4:33 PM PDT 1 min read
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SEOUL, June 18 (Reuters) - SK Hynix said on Thursday it has shipped samples of its latest high-bandwidth memory (HBM
2026-06-16
digitimes.com
2026-06-16
SK Hynix moved closer to shipping seventh-generation high-bandwidth memory, HBM4E, to key customers as timing emerged as a critical competitive factor in the global memory market. According to Newsis, industry sources reported that SK Hynix had recently made positive progress in HBM4E development and was preparing to send samples soon, with shipments possibly beginning in June 2026 and no later th
2026-06-16
www.digitimes.com
2026-06-16
digitimes
SK Hynix moved closer to shipping seventh-generation high-bandwidth memory, HBM4E, to key customers as timing emerged as a critical competitive factor in the global memory market. According to Newsis, industry sources reported that SK Hynix had...
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2026-06-15
www.trendforce.com
2026-06-15
TrendForce
[News] SK hynix Reportedly Pulls Forward HBM4E Sample Timeline, Eyeing June–July Shipments to Key Customers
2026-06-15 Semiconductors editor
News
Please note that this article cites information from Newsis, The Chosun Daily and Yonhap News.
Samsung announced the start of HBM4E sampling in late May and later unveiled an HBM5 mock-up for the first time at COMPUTEX 2026. Against this backdr
2026-05-29
www.chosun.com
2026-05-29
조선일보
By Seongmin K
Published 2026.05.30. 00:45
Samsung Electronics announced on the 29th that it had supplied samples of its 7th-generation high-bandwidth memory (HBM4E) with 12 layers to customers, a world first. HBM is an essential memory semiconductor used in AI accelerators and data centers for AI. Following its February announcement as the first in the semiconductor industry to begin mass produc
2026-05-29
seekingalpha.com
2026-05-29
Seeking Alpha
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2026-05-29
www.neowin.net
2026-05-29
Neowin
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2026-05-29
kfgo.com
2026-05-29
KFGO
By Heekyong Yang
SEOUL, May 29 (Reuters) – Samsung Electronics on Friday said it started shipping samples of its latest high-bandwidth memory (HBM) chip to customers, pulling ahead of rivals in distributing a new version of the product critical to AI data centers and sending its shares higher.
The South Korean tech company said the new chip, the 12-layer HBM4E, is more than 20% faster than its
2026-05-29
wtvbam.com
2026-05-29
WTVB
By Heekyong Yang
SEOUL, May 29 (Reuters) – Samsung Electronics on Friday said it started shipping samples of its latest high-bandwidth memory (HBM) chip to customers, pulling ahead of rivals in distributing a new version of the product critical to AI data centers and sending its shares higher.
The South Korean tech company said the new chip, the 12-layer HBM4E, is more than 20% faster than its
2026-05-29
whtc.com
2026-05-29
WHTC
By Heekyong Yang
SEOUL, May 29 (Reuters) – Samsung Electronics on Friday said it started shipping samples of its latest high-bandwidth memory (HBM) chip to customers, pulling ahead of rivals in distributing a new version of the product critical to AI data centers and sending its shares higher.
The South Korean tech company said the new chip, the 12-layer HBM4E, is more than 20% faster than its
2026-05-29
digitimes.com
2026-05-29
Samsung Electronics has started shipping samples of its latest high-bandwidth memory (HBM) chip, the 12-layer HBM4E, marking the industry's first delivery of the next-generation AI memory product, according to the company. The move underscores intensifying competition among memory suppliers as demand accelerates for higher-performance components used in AI computing systems.
2026-05-29
www.reuters.com
2026-05-29
Reuters
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2026-05-29
news.samsung.com
2026-05-29
samsung.com
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2026-05-25
www.thelec.net
2026-05-25
thelec.net
Micron's sixth-generation high bandwidth memory (HBM4) production ramp-up is progressing smoothly. (Photo: Micron)
Micron Technology's ramp-up of sixth-generation high bandwidth memory (HBM4) production capacity is progressing smoothly. The company also plans to begin mass production of next-generation HBM4E standard products next year.
Manish Bhatia, executive vice president of global operation
2026-05-25
www.digitimes.com
2026-05-25
digitimes
Micron Technology said persistent supply constraints and accelerating AI demand are shaping its long-term technology roadmap, with 1-gamma DRAM, G9 NAND, and next-generation HBM products driving growth through 2027. The company is expanding EUV adoption,...
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2026-05-25
digitimes.com
2026-05-25
Micron Technology said persistent supply constraints and accelerating AI demand are shaping its long-term technology roadmap, with 1-gamma DRAM, G9 NAND, and next-generation HBM products driving growth through 2027. The company is expanding EUV adoption, deepening collaboration with customers and foundry partners, and using multi-year supply agreements to support future capacity investments.