Semiconductor News & Analysis Feed

사진 확대 [Photo courtesy of Yonhap News] SK hynix has unveiled a new iHBM technology that dramatically reduces heat by embedding Integrated Cooling Elements (ICE) in High Bandwidth Memory (HBM) packages. HBM is a core component of AI semiconductors, but as each new generation stacks more layers and demands for speed continue to rise, heat generation has emerged as the biggest challenge. ICE is a co

Heat management has become a critical challenge as HBM technology advances, with higher stacking and faster speeds to meet surging global demand for AI data processing. Efficient control of power density in the die-to-die physical layer between HBM and GPUs is now central to next-generation HBM competitiveness and data center reliability.