Semiconductor News & Analysis Feed
15 articles
2026-08-17
www.digitimes.com
2026-08-17
This week's semiconductor news highlights the expanding influence of artificial intelligence (AI) across the entire industry stack. From AI supernode development to next-generation memory technologies, liquid cooling, and supply chain shifts, AI is driving transformation across the sector. China's A
2026-08-17
2026-08-06
2026-08-06
finance.yahoo.com
2026-08-06
2026-08-06
2026-08-06
www.igorslab.de
2026-08-06
2026-07-27
news.google.com
2026-07-27
2026-07-25
hothardware.com
2026-07-25
As global demand for AI computing continues to outpace available hardware, NVIDIA and South Korea’s SK Group have entered into a landmark $500 billion partnership. Centered on a 2-gigawatt AI cloud facility in South Korea, the deal leverages NVIDIA’s DSX AI factory architecture and SK Hynix’s HBM4 m
2026-06-29
www.digitimes.com
2026-06-29
Taiwan's semiconductor industry is actively joining the race for next-generation memory technology, particularly focusing on post-HBM (High Bandwidth Memory) developments. According to DIGITIMES, Taiwan's Powerchip Semiconductor Manufacturing Corp. (PSMC) and AP Memory are collaborating with Intel a
2026-06-18
www.benzinga.com
2026-06-18
SK Hynix, as a key supplier to NVIDIA, has delivered next-generation high-bandwidth memory (HBM) samples to major customers, marking a significant breakthrough in the semiconductor industry's advancement toward AI and high-performance computing. HBM technology, by stacking multiple DRAM layers, dram
2026-06-04
www.tradingview.com
2026-06-04
2026-05-27
www.techspot.com
2026-05-27
SK Hynix is embedding cooling technology into High Bandwidth Memory (HBM) chips to address overheating issues in AI processors. This innovation reflects the growing demand for thermal solutions in AI computing as chip power consumption and heat generation continue to rise with expanding AI models. H
2026-05-18
www.sammyfans.com
2026-05-18
2026-05-11
www.techpowerup.com
2026-05-11
2026-05-11
www.heygotrade.com
2026-05-11