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2026-06-08
Infineon launches 750V CoolSiC H-DPAK half-bridge devices - Bisinfotech
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www.bisinfotech.com 2026-06-08 Bisinfotech
Home/ Semiconductor Component/ Automotive Electronics/Infineon Expands 750V CoolSiC Portfolio with H-DPAK Devices Infineon Expands 750V CoolSiC Portfolio with H-DPAK Devices Vaishali Chauhan June 8, 2026 2 minutes read Power conversion architectures in automotive and industrial applications are evolving rapidly, placing new demands on switching topologies, thermal management, and system integ
InfineonCoolSiCPower SemiconductorAutomotive ElectronicsIndustrial ApplicationsH-DPAK PackageSiC DevicePower Conversion
2026-06-04
Infineon's new H-DPAK puts a 750 V CoolSiC half-bridge in a top-side-cooled package for EV OBCs and DC-DC converters - Charged EVs
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news.google.com 2026-06-04 Charged EVs