Semiconductor News & Analysis Feed
8383 articles
2026-05-27
eetimes.com
2026-05-27
Gary Hilson
University of Saskatchewan will leverage quantum computing for health, defense, energy, and agriculture research.
2026-05-27
www.wsj.com
2026-05-27
WSJ
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2026-05-27
www.marketscreener.com
2026-05-27
marketscreener.com
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2026-05-27
www.tradingview.com
2026-05-27
TradingView
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2026-05-27
insurancenewsnet.com
2026-05-27
InsuranceNewsNet
insurancenewsnet.com
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2026-05-27
www.digitimes.com
2026-05-27
digitimes
SK Hynix has unveiled a new high-bandwidth memory technology designed to reduce heat buildup in next-generation AI systems, as rising computing density turns thermal management into a more critical front for HBM suppliers.
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2026-05-27
www.digitimes.com
2026-05-27
digitimes
Samsung Electronics' 2026 tentative labor-management agreement is expected to pass after already surpassing an 86% voting participation rate within just three days. While the agreement has temporarily eased concerns over potential strikes, South Korea's...
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2026-05-27
www.digitimes.com
2026-05-27
digitimes
Huawei's Tau Law proposal is rapidly redirecting attention across China's semiconductor industry away from pure lithography competition and toward advanced packaging, 3D stacking, optical interconnects, and system-level architecture design.
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2026-05-27
www.donga.com
2026-05-27
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2026-05-27
aijourn.com
2026-05-27
The AI Journal
BILLERICA, Mass. & TOKYO–(BUSINESS WIRE)–Entegris, Inc. (Nasdaq: ENTG), a global leader in advanced materials and purity solutions for the semiconductor industry, and JSR Corporation, a materials innovation leader and the parent company of Inpria Corporation, today announced entry into a non-exclusive cross-licensing agreement aimed at helping the semiconductor industry advance extreme ultraviolet
2026-05-27
www.gurufocus.com
2026-05-27
GuruFocus
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2026-05-27
www.cnbc.com
2026-05-27
CNBC
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2026-05-27
www.manilatimes.net
2026-05-27
The Manila Times
~ Enabling Next-Generation Power Solutions ~
SHANGHAI, May 27, 2026 /PRNewswire/ -- USI, a global leader in electronic design and manufacturing services, today announced a breakthrough in advanced power semiconductor packaging technology designed for next-generation power solutions. Leveraging its innovative substrate and module integration capabilities, USI has successfully embedded silicon carb
2026-05-27
www.01net.it
2026-05-27
01net
www.01net.it
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2026-05-27
idahonews.com
2026-05-27
KBOI
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2026-05-27
idahonews.com
2026-05-27
KBOI
BOISE, Idaho (CBS2) — Boise-based Micron Technology has officially crossed into rare territory on Wall Street, briefly topping a $1 trillion market valuation Tuesday after another explosive rally in semiconductor stocks.
Shares of Micron (NASDAQ: MU) surged nearly 20% during Tuesday trading, extending gains from the previous session as investors poured money into artificial intelligence-related c
2026-05-27
www.stocktitan.net
2026-05-27
Stock Titan
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2026-05-27
news.google.com
2026-05-27
Business Wire
2026-05-27
www.prnewswire.com
2026-05-27
PR Newswire
USI Showcases Advanced SiC Chip-Embedded Packaging Technology at PCIM Europe 2026 APAC - English
NEWS PROVIDED BY
USI
27 May, 2026, 07:00 CST
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~ Enabling Next-Generation Power Solutions ~
SHANGHAI, May 27, 2026 /PRNewswire/ -- USI, a global leader in electronic design and manufacturing services, today announced a breakthrough in advanced power semiconductor packaging
2026-05-27
www.idahopress.com
2026-05-27
Idaho Press
BOISE — Welcome to the trillion dollar club, Micron.
Boise-headquartered Micron Technology’s stock price closed the trading day Tuesday up 19.29% to $895.88 per share, giving the semiconductor company a $1 trillion market cap.
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