InPsytech, the intellectual property unit of Egis Technology Group, announced on May 21 that it hired a former Altera CEO and ex-Intel executive as a senior strategy adviser to support global market expansion and large-scale growth. The firm said the appointment aims to leverage the adviser's semiconductor leadership experience to guide worldwide strategy and help scale the company's business in i

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During a keynote discussion session at Tech Forum 2026, DIGITIMES senior reporter Monica Chen and semiconductor analyst Andrew Lu shared their views on current AI server technology transformations, concerns over capital expenditure bubbles among global cloud giants, changes in application-specific integrated circuits (ASICs) and chip architectures, and TSMC's global expansion strategy.

TSMC said on May 14, 2026, that it is rapidly expanding CoWoS and SoIC advanced packaging capacity as AI demand drives the construction of 18 new fabs and advanced packaging facilities worldwide. At its 2026 Technology Symposium, TSMC vice president Bor-Zen Tien detailed the company's latest progress in advanced process nodes, 3DFabric advanced packaging, global expansion, and AI-powered smart man

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