Semiconductor News & Analysis Feed
6854 articles
2026-05-26
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2026-05-26
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2026-05-26
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2026-05-26
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2026-05-26
Seeking Alpha
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www.ad-hoc-news.de
2026-05-26
AD HOC NEWS
Infineons, Billion
Infineon's €1.5 Billion AI Revenue Bet Fuels a 100% Rally and a Corporate Reshuffle
26.05.2026 - 05:01:42 | boerse-global.de
Infineon stock nearly doubles in 2026 on AI data center sales forecast of €1.5B, with restructuring and strong margins boosting investor confidence.
Infineon's €1.5 Billion AI Revenue Bet Fuels a 100% Rally and a Corporate Reshuffle - Foto: über boerse-g
2026-05-26
finance.yahoo.com
2026-05-26
Yahoo Finance
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2026-05-26
www.upi.com
2026-05-26
upi.com
May 25 (Asia Today) -- Employees at Taiwanese semiconductor giant TSMC are reportedly growing increasingly frustrated over rumors of layoffs and bonus cuts despite the company posting record first-quarter earnings.
According to Beijing-based sources familiar with Taiwan's economy, TSMC delivered what analysts described as extraordinary results in the first quarter of this year.
Revenue rose 40.6
2026-05-26
finance.yahoo.com
2026-05-26
Yahoo Finance
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2026-05-26
www.ad-hoc-news.de
2026-05-26
AD HOC NEWS
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2026-05-26
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2026-05-26
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2026-05-26
digitimes.com
2026-05-26
South Korea and the Netherlands are looking to broaden their semiconductor partnership beyond ASML's EUV lithography machines, as silicon photonics (SiPh) emerges as a potential next field of cooperation amid rising power and bandwidth demands from AI data centers.
2026-05-26
digitimes.com
2026-05-26
Taiwan Semiconductor Manufacturing Company (TSMC) will reportedly cut employee bonuses by 15%, prompting some employees to voice dissatisfaction on social media. They argued that while TSMC's profits have soared, the share allocated to employee bonuses has decreased rather than increased, with some employees threatening to follow Samsung Electronics' union with a strike to fight for their rights.
2026-05-26
digitimes.com
2026-05-26
Powerchip announced it will present a "3D AI Foundry" showcase at COMPUTEX 2026 to demonstrate 3D wafer-on-wafer (WoW) DRAM stacking, interposers, and Si-cap integrated passive devices as part of an end-to-end offering for AI chips, addressing rising demand for GenAI and high-performance computing for memory capacity, bandwidth, and energy efficiency. The firm said it is leveraging its combined lo
2026-05-26
digitimes.com
2026-05-26
ADATA Technology said it will present a cloud-to-edge artificial intelligence ecosystem at COMPUTEX 2026, bringing together its enterprise storage brand TRUSTA, ADATA Industrial, gaming brand XPG, and AIoT unit ATrack to showcase hardware and software integrations across data centers, PCs, and edge devices. The company announced partnerships and cross-domain integrations with Nvidia, Intel, Advant
2026-05-26
digitimes.com
2026-05-26
Heat management has become a critical challenge as HBM technology advances, with higher stacking and faster speeds to meet surging global demand for AI data processing. Efficient control of power density in the die-to-die physical layer between HBM and GPUs is now central to next-generation HBM competitiveness and data center reliability.
2026-05-26
digitimes.com
2026-05-26
Following the conclusion of the Trump-Xi meeting and amid continued delays in China approving imports of Nvidia H20 GPUs, China's National Development and Reform Commission (NDRC) on May 22 sent a strong policy signal on artificial intelligence (AI) self-sufficiency, explicitly calling for greater efforts to pair domestic large language models with domestically developed computing chips.