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ISTE's FOUP cleaner for HBM back-end processes. (Photo: ISTE) ISTE announced on June 17 that it has received an initial order from Samsung Electronics for front-opening unified pod (FOUP) cleaning equipment designed for high-bandwidth memory (HBM) manufacturing. The deal adds Samsung to ISTE's customer base alongside SK hynix. FOUP cleaners are used to remove contaminants from the sealed carrier

TSS Semiconductor Alliance, a group of 18 small and medium-sized Taiwanese suppliers of semiconductor materials, components and equipment, is preparing to form a third cohort as members seek to expand their role in global chip supply chains.