digitimes.com
2026-06-11
Gudeng chairman and CEO Bill Chiu said global demand for AI is driving a wave of 2nm and 3nm advanced-node capacity expansion, but the biggest constraint for chipmakers is not building fabs — it is securing extreme ultraviolet lithography systems.
digitimes.com
2026-05-26
Grace Wang, vice president and general manager of ASML in Taiwan, said that ASML plans to deploy extreme ultraviolet (EUV) and next-generation high numerical aperture (high-NA) EUV technologies to reduce energy consumption per wafer at the process level, while continuing to deepen its presence in Taiwan. The company also plans to hire around 1,000 new employees in Taiwan in 2026 to support custome