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2026-05-27
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2026-05-27
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2026-05-27
www.eenewseurope.com
2026-05-27
eeNews Europe
Infineon has expanded its CoolGaN BDS 40 V G3 bidirectional switch family with two devices for compact portable power designs. The IGK048B041S and IGK120B041S are intended for smartphones, notebooks and wearables, where board space and power-path efficiency remain tight design constraints.
For eeNews Europe readers, the update is relevant because it shows how GaN is moving further into low-voltag
2026-05-27
www.eletimes.ai
2026-05-27
ELE Times
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HomeElectronicsInfineon Exhibits Semiconductor Solutions for Power Infrastructure, AI Data Centers, Robotics, and...
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Infineon Exhibits Semiconductor Solutions for Power Infrastructure, AI Data Centers, Robotics, and Electromobility at PCIM Europe 2026
ELE Times News
May 27, 2026
PCIM 2026
At PCIM Europe 2026 in Nuremberg
2026-05-27
www.eqs-news.com
2026-05-27
EQS News
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2026-05-27
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2026-05-27
PR Newswire
USI Showcases Advanced SiC Chip-Embedded Packaging Technology at PCIM Europe 2026 Deutschland - English
VOM NACHRICHTENDIENST
USI
27 Mai, 2026, 05:00 GMT
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~ Enabling Next-Generation Power Solutions ~
SHANGHAI, May 27, 2026 /PRNewswire/ -- USI, a global leader in electronic design and manufacturing services, today announced a breakthrough in advanced power semiconductor pa
2026-05-27
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2026-05-27
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2026-05-27
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2026-05-27
The Manila Times
~ Enabling Next-Generation Power Solutions ~
SHANGHAI, May 27, 2026 /PRNewswire/ -- USI, a global leader in electronic design and manufacturing services, today announced a breakthrough in advanced power semiconductor packaging technology designed for next-generation power solutions. Leveraging its innovative substrate and module integration capabilities, USI has successfully embedded silicon carb
2026-05-27
www.prnewswire.com
2026-05-27
PR Newswire
USI Showcases Advanced SiC Chip-Embedded Packaging Technology at PCIM Europe 2026 APAC - English
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27 May, 2026, 07:00 CST
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~ Enabling Next-Generation Power Solutions ~
SHANGHAI, May 27, 2026 /PRNewswire/ -- USI, a global leader in electronic design and manufacturing services, today announced a breakthrough in advanced power semiconductor packaging
2026-05-27
marklapedus.substack.com
2026-05-27
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Europe Launches New Chip/Packaging R&D Projects
These projects include GaN/SiC packaging, quasi-monolithic integration, 3D qub
2026-05-27
us.acrofan.com
2026-05-27
acrofan.com
~ Enabling Next-Generation Power Solutions ~
SHANGHAI, May 27, 2026 /PRNewswire/ -- USI, a global leader in electronic design and manufacturing services, today announced a breakthrough in advanced power semiconductor packaging technology designed for next-generation power solutions. Leveraging its innovative substrate and module integration capabilities, USI has successfully embedded silicon carb
2026-05-27
www.manilatimes.net
2026-05-27
The Manila Times
Visit ROHM at booth 318 in hall 9
Demonstrating cutting edge power semiconductor technologies.
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Santa Clara, CA and Willich/Nuremberg, Germany, May 26, 2026 (GLOBE NEWSWIRE) --
2026-05-27
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2026-05-27
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2026-05-26
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2026-05-26
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