Semiconductor News & Analysis Feed
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2026-05-29
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2026-05-29
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2026-05-29
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2026-05-29
KED Global
2026-05-29
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2026-05-29
Moomoo
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2026-05-29
www.automotiveworld.com
2026-05-29
Automotive World
Infineon has introduced a 1300 V SiC power module operating at 205°C, 30 degrees above the industry standard, for EV inverter use
May 29, 2026
Infineon Technologies has introduced a 1300 V silicon carbide (SiC) power module for electric vehicle (EV) inverters, the first within its HybridPACK Drive family capable of continuous operation at 205°C, a 30°C increase over the 175°C industry standard.
2026-05-29
www.devdiscourse.com
2026-05-29
Devdiscourse
Huawei's LogicFolding Revolution: Breaking Through Chip Design Barriers
Huawei's innovative chip design principle, focusing on signal speed rather than shrinking semiconductors, introduces a new path for China amidst U.S. sanctions. Their approach, known as the Tau Scaling Law, seeks to enhance chip efficiency via tightly connected structures, although its true impact remains debated within the in
2026-05-29
www.moomoo.com
2026-05-29
Moomoo
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2026-05-29
www.geneonline.com
2026-05-29
geneonline.com
Infineon Technologies AG has joined NVIDIA’s MGX AI factory ecosystem to develop advanced power delivery architectures for next-generation AI server racks. The collaboration focuses on creating solutions that meet the increasing power demands of AI workloads, enhancing system efficiency, and reducing overall energy consumption in data centers.
Infineon’s contributions will include developing high
2026-05-29
www.ad-hoc-news.de
2026-05-29
AD HOC NEWS
Infineon’s, Infrastructure
Infineon’s AI Infrastructure Play Deepens With d-Matrix Tie-Up, Even as the Stock Stretches Into Overbought Territory
29.05.2026 - 03:06:31 | boerse-global.de
Infineon's partnership with d-Matrix and GaN patent win position it at the heart of the data-center power revolution, driving a 109% YTD stock surge to €80.16.
Infineon’s AI Infrastructure Play Deepens With d-Mat
2026-05-29
developer.nvidia.com
2026-05-29
NVIDIA Developer
AI applications are moving beyond text generation to multimodal systems that can perceive, search, and reason across images, documents, video, and language in real time—turning fragmented information into actionable insights.
Step 3.7 Flash, the latest from StepFun, brings these capabilities to production and enterprise-scale, available on NVIDIA-accelerated infrastructure. It is a 198B-paramet
2026-05-29
digitimes.com
2026-05-29
MediaTek held its shareholders' meeting on May 29. Addressing the company's future outlook, Chairman Ming-Kai Tsai said that while the mobile phone market in 2026 has performed below expectations due to a sharp rise in memory prices, MediaTek's market share in various connectivity chips has increased significantly. He also noted that the company began generating revenue from AI data centers in 202
2026-05-29
digitimes.com
2026-05-29
Generative AI, HPC, and large data centers are raising demand for chips with higher power efficiency, stronger thermal control, and denser packaging, making advanced packaging a more strategic part of the semiconductor supply chain. In China, panel-level packaging (PLP) is gaining traction for its larger format, higher output, and lower-cost potential.
2026-05-29
digitimes.com
2026-05-29
Airoha Technology is sharpening its strategy around global networking and edge AI chips, aiming to expand its customer base and strengthen its competitive moat. The MediaTek subsidiary is targeting infrastructure, audio, and positioning markets with products already shipping, in production, or advancing through development milestones that could matter to users and operators worldwide.
2026-05-29
digitimes.com
2026-05-29
Unimicron said it will push advanced substrate and AI system-board upgrades in 2026 to capture accelerating demand for AI-related ASICs and switches, aiming for record revenue that would exceed its 2022 peak. The IC substrate and printed circuit board maker announced the strategy at its annual shareholders' meeting at the end of May, citing a shift in demand away from GPUs and CPUs toward ASICs, s
2026-05-29
digitimes.com
2026-05-29
Arm EVP and Chief Commercial Officer Will Abbey visited QBit Semiconductor's Taiwan headquarters on May 27, signaling deeper cooperation that could shape future chip design for edge AI, physical AI, and quantum-computing cybersecurity. The visit highlights how platform alliances are increasingly influencing next-generation computing architectures for global technology markets.
2026-05-29
digitimes.com
2026-05-29
Nvidia CEO Jensen Huang gave a media interview after the "trillion-dollar dinner" in Taipei, Taiwan, on May 28, commenting on topics including competition in the artificial intelligence (AI) industry, cloud service providers (CSP) developing in-house application-specific integrated circuits (ASIC), Huawei's technological progress, Taiwan's role as a center of the AI revolution, and energy demand.
2026-05-29
digitimes.com
2026-05-29
AI demand for high-performance chips is driving up orders for semiconductor silicon capacitors, or Si-Caps, with Samsung Electro-Mechanics and several Taiwanese memory makers emerging as key names to watch. Supply-chain sources say the shift could reshape who captures future demand for advanced packaging.
2026-05-29
digitimes.com
2026-05-29
Oppstar Bhd has restructured the delivery framework of an artificial intelligence chip development project with a Yokohama-based client, replacing an earlier tripartite arrangement with separate design services agreements and formalizing a US$2.9 million contract for its engineering scope, according to The Edge Malaysia.
2026-05-29
digitimes.com
2026-05-29
Genius Electronic Optical (GSEO) held its shareholders meeting on May 29, with chairman Jones Chen and president Ying-Li Guo in attendance. GSEO reported standalone revenue of NT$20.89 billion (approx. US$665.7 million) in 2025, up 13% from NT$18.496 billion in 2024. Consolidated revenue reached NT$24.989 billion, increasing 8% from NT$23.187 billion in 2024. Earnings per share (EPS) came in at NT
2026-05-29
digitimes.com
2026-05-29
Chinese CMOS image sensor supplier SmartSens Technology announced on May 26 that it has entered into a strategic partnership with Chinese IC design company Unisoc to jointly develop Micro LED-based high-speed optical interconnect technology, targeting applications in AI computing clusters, smart vehicles, and industrial vision.
2026-05-29
digitimes.com
2026-05-29
C2i Semiconductors has advanced its power management technology with the tape-out of a chip designed for AI infrastructure, while also securing fresh venture backing to expand development and scale production. The developments underscore growing investor interest in addressing power delivery bottlenecks in data centers, driven by accelerating AI workloads.