Semiconductor News & Analysis Feed

2698 articles
2026-05-25
www.businesstimes.com.sg 2026-05-25 The Business Times
China’s Huawei reveals chip design breakthrough amid US sanctions The company’s Ascend chip series has become increasingly central to powering Chinese artificial intelligence models Summarise Share Add BT as a preferred source Published Mon, May 25, 2026 · 10:10 AM — Updated Mon, May 25, 2026 · 01:24 PM Huawei unveiled on Monday a new principle for improving chips, noting the industry can no l
2026-05-25
www.globaltimes.cn 2026-05-25 Global Times
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2026-05-25
www.tradingview.com 2026-05-25 TradingView
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2026-05-25
www.reuters.com 2026-05-25 Reuters
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2026-05-25
www.marketscreener.com 2026-05-25 marketscreener.com
Access Denied You don't have permission to access "http://www.marketscreener.com/news/huawei-proposes-new-path-for-chip-development-amid-us-sanctions-ce7f5adcd18df427" on this server. Reference #18.860ed217.1779758561.7b964c8c https://errors.edgesuite.net/18.860ed217.1779758561.7b964c8c
2026-05-25
www.scmp.com 2026-05-25 South China Morning Post
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2026-05-25
digitimes.com 2026-05-25
Nvidia's structural pivot to isolate its ACIE market and AMD's US$10 billion investment in Taiwan infrastructure signal a profound realignment in the AI chip war. Both developments reflect a shared urgency to expand beyond traditional hyperscale clouds into the booming, highly lucrative global enterprise, industrial, and sovereign AI factory frontiers.
2026-05-25
digitimes.com 2026-05-25
The shift toward 800V high-voltage direct current (HVDC) power architectures in AI data centers is driving a surge in demand for power semiconductors, boosting shipments for Taiwanese lead frame suppliers SDI Corporation and Jih Lin Technology and raising expectations for double-digit revenue growth in 2026.
2026-05-25
digitimes.com 2026-05-25
Huawei is using self-developed packaging technology to build ultra-high-capacity enterprise SSDs, underscoring how Chinese technology companies are increasingly turning to advanced packaging and system-level engineering to navigate US semiconductor restrictions.
2026-05-25
digitimes.com 2026-05-25
As the global semiconductor industry confronts the limits of Moore's Law, Huawei has unveiled a new roadmap aimed at extending chip performance growth through architecture, interconnect, and system-level optimisation rather than pure transistor miniaturisation.
2026-05-25
theaiinsider.tech 2026-05-25 AI Insider
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2026-05-25
finance.yahoo.com 2026-05-25 Yahoo Finance
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2026-05-25
www.barchart.com 2026-05-25 Barchart
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2026-05-25
finance.yahoo.com 2026-05-25 Yahoo Finance
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2026-05-25
www.fool.com 2026-05-25 The Motley Fool
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2026-05-25
247wallst.com 2026-05-25 24/7 Wall St.
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2026-05-25
finance.yahoo.com 2026-05-25 Yahoo Finance
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2026-05-24
eciks.org 2026-05-24 eciks.org
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2026-05-24
tomshardware.com 2026-05-24 Mark Tyson
The first Cray T3D supercomputer ever produced, serial number 6001, was recently put up for auction, with opening bids from £60,000 (~$81,000) invited.
2026-05-24
seekingalpha.com 2026-05-24 Seeking Alpha
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