Semiconductor News & Analysis Feed
3055 articles
2026-05-26
simplywall.st
2026-05-26
simplywall.st
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2026-05-26
www.digitimes.com
2026-05-26
digitimes
Following GlobalWafers' shareholders' meeting on May 25, Chairperson Doris Hsu stated that the company's core compound semiconductor business, gallium nitride (GaN), is addressing strong demand for high-efficiency power solutions in AI servers. The company is...
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2026-05-26
news.futunn.com
2026-05-26
富途牛牛
Unity Software(U.US) reported fourth-quarter financial results after the market close on Monday. Here's a rundown of the report.Q4 Earnings: Unity said fourth-quarter revenue increased 35% year-over-year to $609 million, beating the consensus estimate of $562.71 million. The company reported a quarterly loss of 66 cents per share.
Due to copyright issues, news from Dow Jones is temporarily unavai
2026-05-26
www.japantimes.co.jp
2026-05-26
The Japan Times
Taiwan overtook India in stock market value, powered mainly by a breakneck rally in the world’s largest chipmaker Taiwan Semiconductor Manufacturing Co.
The island’s market capitalization climbed to $4.95 trillion as of Monday, according to data compiled by Bloomberg. India’s value has dropped to $4.92 trillion. Taiwan’s stock market is now the fifth largest in the world, behind only the U.S., ma
2026-05-26
www.thefastmode.com
2026-05-26
The Fast Mode
Stellantis and Qualcomm Technologies announced an expansion of their multi-year technology collaboration to power next-generation Stellantis vehicles with Qualcomm Technologies’ Snapdragon® Digital Chassis™ system-on-chips (SoCs).
The expanded collaboration integrates Snapdragon Digital Chassis solutions with STLA Brain, Stellantis’ electronic and software platform, enhancing cockpit, connectivit
2026-05-26
www.bloomberg.com
2026-05-26
Bloomberg.com
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2026-05-26
finance.yahoo.com
2026-05-26
Yahoo Finance
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2026-05-26
digitimes.com
2026-05-26
South Korea and the Netherlands are looking to broaden their semiconductor partnership beyond ASML's EUV lithography machines, as silicon photonics (SiPh) emerges as a potential next field of cooperation amid rising power and bandwidth demands from AI data centers.
2026-05-26
digitimes.com
2026-05-26
Powerchip announced it will present a "3D AI Foundry" showcase at COMPUTEX 2026 to demonstrate 3D wafer-on-wafer (WoW) DRAM stacking, interposers, and Si-cap integrated passive devices as part of an end-to-end offering for AI chips, addressing rising demand for GenAI and high-performance computing for memory capacity, bandwidth, and energy efficiency. The firm said it is leveraging its combined lo
2026-05-26
digitimes.com
2026-05-26
ADATA Technology said it will present a cloud-to-edge artificial intelligence ecosystem at COMPUTEX 2026, bringing together its enterprise storage brand TRUSTA, ADATA Industrial, gaming brand XPG, and AIoT unit ATrack to showcase hardware and software integrations across data centers, PCs, and edge devices. The company announced partnerships and cross-domain integrations with Nvidia, Intel, Advant
2026-05-26
digitimes.com
2026-05-26
Holy Stone Enterprise warns that AI-driven power upgrades are creating global shortages and record demand for multilayer ceramic capacitors (MLCCs), with lead times beyond 20 weeks and tighter supply expected through 2027. The developments could reshape supply chains for servers, data centers, and high-power consumer electronics worldwide, and accelerate global investment in components.
2026-05-26
digitimes.com
2026-05-26
AI computing's massive demand for infrastructure is making interconnect and laser technologies key to overcoming power and bandwidth limits, prompting silicon photonics unicorn Lightmatter to unveil its latest laser product, Guide DR. To advance its 3D-stacked silicon photonics engine, Lightmatter is also working closely with TSMC using its Compact Universal Photonic Engine (COUPE) platform.
2026-05-26
digitimes.com
2026-05-26
GlobalWafers held its shareholders' meeting on May 25, where CEO Doris Hsu stated that the semiconductor market in 2026 has gradually moved beyond 2025's two extremes, when only AI and advanced process technologies dominated growth. In 2026, non-AI and traditional application markets began to recover, making market conditions thrive.
2026-05-26
digitimes.com
2026-05-26
Intel CEO Lip-Bu Tan is set to arrive in Taiwan this weekend, joining AMD CEO Lisa Su and Nvidia CEO Jensen Huang in a high-stakes push by the world's top chip leaders to deepen ties with Taiwanese partners ahead of Computex 2026.
2026-05-26
digitimes.com
2026-05-26
AI servers are driving a surge in demand for high-end passive components, rapidly eating into multilayer ceramic capacitor (MLCC) capacity and extending lead times to more than 16–20 weeks. As a result, some orders that once went to major Japanese and South Korean suppliers are gradually spilling over to Taiwan-based makers.
2026-05-26
digitimes.com
2026-05-26
Samsung Electronics is reportedly preparing to allocate much of its Pyeongtaek P4 cleanroom capacity to next-generation high-bandwidth memory (HBM) in 2027, a move that could tighten the supply of general-purpose DRAM as memory makers shift more production toward higher-value AI server products.
2026-05-26
digitimes.com
2026-05-26
Following GlobalWafers' shareholders' meeting on May 25, Chairperson Doris Hsu stated that the company's core compound semiconductor business, gallium nitride (GaN), is addressing strong demand for high-efficiency power solutions in AI servers. The company is also beginning to see emerging demand from diversified applications such as AI robotics. As a result, production capacity in 2026 has alread
2026-05-26
digitimes.com
2026-05-26
When AMD CEO Lisa Su arrived in Taiwan on May 20, she announced plans to invest more than US$10 billion with local supply-chain partners and the island's broader semiconductor ecosystem. The goal, she said, was to help secure a long-term supply of advanced artificial intelligence (AI) chips.
2026-05-26
digitimes.com
2026-05-26
Facing expanding opportunities in both optical communications and satellite connectivity, Dennis Chen, chairman of WIN Semiconductors, said the company is actively advancing a range of products, including driver ICs, continuous-wave (CW) lasers, and photodiodes, while also ramping up capacity in anticipation of growing demand from next-generation networks.
2026-05-26
digitimes.com
2026-05-26
The race to dominate next-generation NAND flash memory has long been measured in layers — and Samsung Electronics appears to be pulling ahead. The South Korean chipmaker has reportedly developed a 900-layer-class V-NAND prototype, a significant leap that brings the memory industry closer to the 1,000-layer threshold as chipmakers intensify efforts to pack more storage into smaller chips while cutt