Semiconductor News & Analysis Feed

2967 articles
2026-05-28
tomshardware.com 2026-05-28 Jowi Morales
Law enforcement agencies are warning that protests over AI and data centers could boil over and turn into civil unrest.
2026-05-28
www.proactiveinvestors.com 2026-05-28 Proactive financial news
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2026-05-28
ca.finance.yahoo.com 2026-05-28 Yahoo! Finance Canada
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2026-05-28
finance.yahoo.com 2026-05-28 Yahoo Finance
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2026-05-28
seekingalpha.com 2026-05-28 Seeking Alpha
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2026-05-28
www.purdue.edu 2026-05-28 Purdue University
Purdue, GCCS partner to scale the future of silicon carbide Joint initiative targets critical thermal and power bottlenecks in global AI infrastructure Dan DeLaurentis, Purdue’s executive vice president for research, left, and Kuan-Ming Hsiung, GeChi Compound Semiconductor Co. chairman of the board, signed a research memorandum of understanding at Hovde Hall. The agreement will strengthen collab
2026-05-28
www.msn.com 2026-05-28 MSN
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2026-05-28
tomshardware.com 2026-05-28 Luke James
FROST exploits the Origin Private File System (OPFS), a browser API that lets websites create and store files on a user's local disk.
2026-05-28
tomshardware.com 2026-05-28 Jake Roach
Intel has revealed the Arc G3 and G3 Extreme chips, which are built on Panther Lake dies with up to an Arc B390 iGPU. The chips will show up in devices from partners like Acer and OneXPlayer.
2026-05-28
www.thurrott.com 2026-05-28 Thurrott.com
Well, that was quick: Qualcomm is expanding its Snapdragon chips for PCs with a new low-cost entry called Snapdragon C that’s designed for PCs that cost $300 and up. And it’s partnering with Acer, HP, and Lenovo to bring new PCs to market soon. And no, “C” doesn’t stand for cheap. It stands for “Compute,” the name of the business within Qualcomm that makes its PC chips. “As costs rise and custom
2026-05-28
tomshardware.com 2026-05-28 Matt Safford
The first Snapdragon C-powered laptop, the Aspire Go 15, delivers 512GB of storage and 8GB of RAM, plus a good collection of ports for a still-undisclosed ‘entry-tier price point.’
2026-05-28
www.indexbox.io 2026-05-28 IndexBox
This website is using a security service to protect itself from online attacks. The action you just performed triggered the security solution. There are several actions that could trigger this block including submitting a certain word or phrase, a SQL command or malformed data. You can email the site owner to let them know you were blocked. Please include what you were doing when this page came u
2026-05-28
news.google.com 2026-05-28 FXLeaders
2026-05-28
news.google.com 2026-05-28 Midland Daily News
2026-05-28
www.tomshardware.com 2026-05-28 Tom's Hardware
Tech Industry Manufacturing Semiconductors Chinese university builds 3D chip design tool tailored to Huawei's ‘LogicFolding’ architecture — 3D design delivers increased performance and better thermal management News By Luke James published 20 minutes ago China now has a prototype tool designed for vertical circuit stacking. (Image credit: Getty Images) Share this article 0 Join the conversatio
2026-05-28
tomshardware.com 2026-05-28 Luke James
The announcement came two days after Huawei presented LogicFolding and its accompanying Tau Scaling Law at ISCAS 2026.
2026-05-28
news.google.com 2026-05-28 Seeking Alpha
2026-05-28
www.marketbeat.com 2026-05-28 MarketBeat
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2026-05-28
www.marketbeat.com 2026-05-28 MarketBeat
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2026-05-28
dbr.donga.com 2026-05-28 동아비즈니스리뷰 | DBR
㈜동아미디어엔 (온라인비즈니스) 서울시 서대문구 충정로29 동아일보사빌딩 15층 통신판매업신고: 2004-서울서대문-1096 사업자등록번호: 110-81-47558 대표이사: 김승환 ㈜동아일보사 서울시 종로구 청계천로1 동아일보사빌딩 등록번호: 종로라00434 ㅣ 등록일자: 2014.01.16 사업자등록번호: 102-81-0