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Skip to main content Go to the 9to5Mac home page Switch site Toggle social menu Toggle dark mode Toggle search form Forums Store Podcasts iPhone Mac iPad Watch Vision Music and TV Guides AAPL COMPANY INTEL TSMC SAMSUNG ELECTRONICS Report: Apple considers Intel and Samsung to diversify chip manufacturing away from TSMC Marcus Mendes  | May 4 2026 - 8:45 pm PT 2 Comments Bloomberg reports that Appl

Tech Industry Big Tech Intel swipes Qualcomm veteran of 25 years to lead client computing — Alex Katouzian jumps ship to oversee consumer CPUs and physical AI News By Etiido Uko published May 5, 2026 Tech companies are increasingly pivoting towards AI (Image credit: Getty Images / Justin Sullivan) Share this article 1 Join the conversation Follow us Add us as a preferred source on Google Newsle

Long‑running agents, tool-calling LLMs, and multimodal chaos are rewriting edge compu...

The telecom sector's survival hinges on rapid software automation to counteract soaring hardware costs fueled by the booming AI demand.

EU DARE project explores alternatives after Codasip divestment creates uncertainty around roadmap and architectural direction.

Hiwin Technologies and Qualcomm Inc. announced a partnership at Computex 2026 to integrate Qualcomm Dragonwing Q6 series processors into Hiwin's Load Port products, delivering edge AI capabilities for semiconductor panel-level packaging (PLP) equipment. The collaboration positions Hiwin's Load Port as the smart edge node in front-end modules, aiming to improve real-time image processing, status se