Feed Deep Dive Matrix Subscribe About

Semiconductor News & Analysis Feed

355 articles
Trending Companies
NVIDIA32 TSMC16 Samsung9 Intel8 Micron8 SK Hynix8 Microsoft8 Google7 AMD6 Apple6 SK hynix6 Intel Foundry5 Meta5 Sony5 ASML5
Trending Technologies
EUV46 3nm33 DRAM11 HBM8 AI chips7 GPU6 AI6 CPU4 NAND4 2nm4 DDR54 RISC-V4 3D printing4 3D integration3 NPU3
2026-07-16
TSMC eyes record quarter: 2nm ramp drives Q3 guidance above US$44B - digitimes
0.95
www.digitimes.com 2026-07-16 digitimes
2026-07-16
TSMC 2Q26 profit surges 77% to a record on AI demand, first 2nm revenue - digitimes
0.94
www.digitimes.com 2026-07-16 digitimes
2026-07-16
Hanmi, Hanwha clash in court over HBM equipment patents - digitimes
0.75
www.digitimes.com 2026-07-16 digitimes
2026-07-16
Nvidia doubles down on the land of the rising GPU, wiring Blackwell into Japan's science, banks, factories and cars - digitimes
0.92
www.digitimes.com 2026-07-16 digitimes
2026-07-16
Nvidia doubles down on the land of the rising GPU, wiring Blackwell into Japan's science, banks, factories and cars - digitimes
0.92
www.digitimes.com 2026-07-16 digitimes
2026-07-16
Exclusive: Advanced packaging outpaces front-end growth while NPO paves way for commercial CPO - digitimes
0.95
www.digitimes.com 2026-07-16 digitimes
2026-07-16
Exclusive: Advanced packaging outpaces front-end growth while NPO paves way for commercial CPO - digitimes
0.95
www.digitimes.com 2026-07-16 digitimes
2026-07-16
Exclusive: Advanced packaging outpaces front-end growth while NPO paves way for commercial CPO - digitimes
0.95
www.digitimes.com 2026-07-16 digitimes
2026-07-15
Intel qualifies High-NA EUV for Panther Lake; ASML preps TSMC and Samsung for next wave - digitimes
0.95
www.digitimes.com 2026-07-15 digitimes
2026-07-15
TYLSemi exits stealth with US$43M to accelerate open chiplet platform for custom AI chips - digitimes
0.95
www.digitimes.com 2026-07-15 digitimes
2026-07-15
China's Orient Computing unveils 14nm AI chip designed to bypass HBM constraints - digitimes
0.95
www.digitimes.com 2026-07-15 digitimes
2026-07-15
China's Orient Computing unveils 14nm AI chip designed to bypass HBM constraints - digitimes
0.95
www.digitimes.com 2026-07-15 digitimes
2026-07-14
Intel challenges HBM leaders with XBM and ZAM in a bid to reshape AI memory - digitimes
0.95
news.google.com 2026-07-14 digitimes
2026-07-14
Innolux 1H26 revenue hits 5-year high on auto, advanced packaging - digitimes
0.92
news.google.com 2026-07-14 digitimes
2026-07-14
C Sun sees advanced packaging and PCB demand driving 2026 revenue - digitimes
0.95
news.google.com 2026-07-14 digitimes
2026-07-14
China launches first 8-inch 2D chip line to bypass EUV limits - digitimes
0.88
news.google.com 2026-07-14 digitimes
2026-07-14
Samsung brings HBM, logic, and optics together in packaging push - digitimes
0.95
news.google.com 2026-07-14 digitimes
2026-07-13
CXMT's US$4.3B IPO powers China's HBM challenge to global memory giants - digitimes
0.95
www.digitimes.com 2026-07-13 digitimes
2026-07-13
Chiayi Science Park Phase 2 breaks ground for advanced packaging hub - digitimes
0.85
news.google.com 2026-07-13 digitimes
2026-07-13
Infineon urges TSMC to consider a second Dresden fab as demand outlook evolves - digitimes
0.85
news.google.com 2026-07-13 digitimes