Semiconductor News & Analysis Feed
203 articles
2026-07-08
www.kedglobal.com
2026-07-08
The Korea Economic Daily Global Edition
Samsung to begin world’s 1st mass production of HBM4 in 3rd week of February for Nvidia’s Vera Rubin
Samsung's HBM4 and GDDR7 chips on display at its booth during the Gyeongju APEC CEO Summit meeting in October 2025 (Courtesy of News1) Samsung Electronics Co. will launch the world’s first mass production and shipments of next-generation high-bandwidth memory, HBM4, shortly after the Luna
2026-07-08
know.creditsights.com
2026-07-08
CreditSights
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Nicholas Chen: Analy
2026-07-08
biz.chosun.com
2026-07-08
Chosunbiz
By
Hwang Min-gyu
Published 2026.07.08. 15:17
China CXMT corporations logo. /Courtesy of Reuters Yonhap
An analysis of the securities registration statement submitted by CXMT for a listing on Shanghai's STAR Market found no content related to capital expenditures for high bandwidth memory (HBM). China's drive into HBM, cited as a mid- to long-term threat to Samsung Electronics and SK hynix, is n
2026-07-07
tomshardware.com
2026-07-07
Mark Tyson
Valve’s official account on Reddit has responded to RLOD victims with simple step-by-step instructions to get any affected Steam Machine up and running again.
2026-07-07
seekingalpha.com
2026-07-07
Seeking Alpha
Nvidia-backed Nscale closes $900M revolving credit facility
Jul 07, 2026, 8:42 AM ETNVIDIA Corporation (NVDA) StockBAC, JPM, GS
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By: Chris Ciaccia, SA News Editor
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MattGush
U.K. artificial intelligence startup Nscale said on Tuesday that it has closed a $900M revolving credit facility to help strengthen its balance sheet.
Nscale, which is backed by Nvidia (NVDA)
2026-07-07
www.kedglobal.com
2026-07-07
The Korea Economic Daily Global Edition
S.Korean stocks drop nearly 5% as caution mounts over fading chip rally
The Kospi index closed down 4.91% at 7,656.31 on July 7, 2026 (Courtesy of Yonhap) South Korea's stock market fell nearly 5% on Tuesday as investors shrugged off Samsung Electronics Co.'s stellar quarterly earnings, following Morgan Stanley's warning of fading momentum for chip stocks.Inv
2026-07-07
tomshardware.com
2026-07-07
Etiido Uko
Intel’s XBM patent proposes an HBM alternative that uses backend-transistor DRAM, UCIe chiplet links, and repair logic to reduce packaging costs and complexity.
2026-07-07
www.tomshardware.com
2026-07-07
Tom's Hardware
Tech Industry Manufacturing Semiconductors
Intel patent reveals new XBM memory architecture that ditches HBM's costly silicon interposer — backend-transistor DRAM stack uses UCIe links and built-in repair to ease AI's memory bottleneck
News
By Etiido Uko
Published 2 days ago
The patent was filed 18 months ago, and there's no further indication of ongoing development
(Image credit: Intel)
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2026-07-07
www.kedglobal.com
2026-07-07
The Korea Economic Daily Global Edition
Samsung weighs 10% Galaxy Z8 price hike as AI memory crunch bites
TM Roh, chief of Samsung's DX Division, showcases the Galaxy Z Fold7 at the Galaxy Unpacked event in July 2025 Samsung Electronics Co. is considering a roughly 10% price increase for its upcoming Galaxy Z8 foldable smartphones, as intensifying competition for artificial intelligence chips tight
2026-07-06
digitimes.com
2026-07-06
Longsys Electronics expects a sharp rise in first-half profit as global memory supply stays tight and demand from artificial intelligence-related devices strengthens. The outlook points to firmer conditions across the semiconductor market, with implications for storage prices, component availability, and technology costs worldwide.
2026-07-06
digitimes.com
2026-07-06
Samsung Electronics is negotiating with customers to raise average selling prices for commodity DRAM by as much as 20% in the third quarter of 2026 from the prior quarter, according to ZDNet Korea, which cited industry sources.
2026-07-05
tomshardware.com
2026-07-05
Dan Mateescu
tktk
2026-07-05
news.google.com
2026-07-05
The Korea Economic Daily Global Edition
2026-07-04
www.insidermonkey.com
2026-07-04
Insider Monkey
NEWS
TSMC’s AI Chip Dominance Strengthens Its Credit Outlook
Published on July 4, 2026 at 10:10 am by BOB KARR in News
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Taiwan Semiconductor Manufacturing Company Limited (NYSE:TSM) is one of the Best AI and Technology Stocks to Buy Now. On June 23, S&P Global stated that the company has significantly bolstered its leadership in the broader global semiconductor foundry sector over the past f
2026-07-04
finance.yahoo.com
2026-07-04
Yahoo Finance
TSMC’s AI Chip Dominance Strengthens Its Credit Outlook
Bob Karr
Sat, July 4, 2026 at 7:10 AM PDT 1 min read
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Taiwan Semiconductor Manufacturing Company Limited (NYSE:TSM) is one of the Best AI and Technology Stocks to Buy Now. On June 23, S&P Global stated that the company has significantly bolstered its leadershi
2026-07-03
www.washingtonexaminer.com
2026-07-03
Washington Examiner
Memory chips store the data and instructions that power Nvidia’s accelerated computing platforms, as well as the world’s computers and smartphones. These chips are, put simply, the filing cabinets of the digital economy.
Since the late 1980s, the memory semiconductor market has been characterized by boom-and-bust profit cycles. Periods of strong profitability have routinely been followed by colla
2026-07-03
news.google.com
2026-07-03
Editorji
2026-07-02
www.eletimes.ai
2026-07-02
ELE Times
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HomeNewsInfineon Receives Additional Prestigious Award for Outstanding Investor Relations Work
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Infineon Receives Additional Prestigious Award for Outstanding Investor Relations Work
ELE Times News
July 2, 2026
Infineon
DIRK (German Investor Relations Association) awards Infineon first place for best Investor Relations among DAX 40 compani
2026-07-02
digitimes.com
2026-07-02
Singapore authorities have filed additional fraud and money laundering charges against four individuals and brought fresh charges against four companies, as part of an investigation linked to the movement of servers that may have contained Nvidia artificial intelligence chips subject to US export controls. The case has been reported by multiple outlets, including CNA, The Straits Times, and Reuter
2026-07-02
eetimes.com
2026-07-02
AI has outgrown traditional chips. The future belongs to integrated systems that stack compute, memory, photonics, and power, and HLSI is driving the shift.