Semiconductor News & Analysis Feed
27 articles
2026-07-20
www.rte.ie
2026-07-20
RTE.ie
2026-07-18
eetimes.com
2026-07-18
Meet θ-TaN, a metal that moves heat nearly 3× better than copper—and could upend chip cooling layers.
2026-07-16
eetimes.com
2026-07-16
AI data centers are torching copper’s reign as ST pushes 300-mm silicon photonics for faster, denser optical links.
2026-07-16
semiengineering.com
2026-07-16
Katherine Derbyshire
Nanotwinned copper, SiCN, BCB, and passivating metals are all possibilities
2026-07-15
digitimes.com
2026-07-15
Tower Semiconductor is placing a roughly US$3 billion wager that the artificial-intelligence buildout will force data centers to move data with light rather than electricity, anchoring the bet in Japan with backing from Tokyo.
2026-07-07
digitimes.com
2026-07-07
As generative AI drives rapid growth in high-performance computing (HPC) demand, the semiconductor industry is shifting from process-node competition to materials competition. Geckos chairman Raymond Shen said that once chip manufacturing advances to 2nm and beyond, improvements in AI computing power are no longer just a chip-design issue, but are increasingly constrained by materials' heat dissip
2026-06-28
digitimes.com
2026-06-28
LG Chem is discussing whether to expand production of copper-clad laminate, or CCL, a core material used in semiconductor packaging, as demand tied to artificial intelligence chips accelerates, Herald Businessreported.
2026-06-25
simplywall.st
2026-06-25
simplywall.st
Canada
/
Metals and Mining
/
TSX:HBM
Hudbay Minerals (TSX:HBM) Completes Arizona Sonoran Copper Deal To Build U.S. Copper Pipeline
June 25, 2026
Simply Wall St
Reviewed by
Bailey Pemberton
Hudbay Minerals (TSX:HBM) has completed its acquisition of Arizona Sonoran Copper Company.
The deal combines Hudbay’s Copper World project with the Cactus copper project in Arizona.
The transaction creates a lar
2026-06-25
www.indexbox.io
2026-06-25
IndexBox
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2026-06-23
digitimes.com
2026-06-23
Demand for high-end fiberglass cloth is surging on the AI boom, and orders from copper-clad laminate (CCL) customers are leaving the world's two largest suppliers, Nittobo and Taiwan Glass, short of capacity. In particular, low coefficient of thermal expansion (CTE) and low Dk2 products remain the tightest, with supply-demand gaps now expected to last through 2027.
2026-06-18
news.google.com
2026-06-18
Stock Titan
2026-06-18
digitimes.com
2026-06-18
The AI wave is rapidly reshaping the global semiconductor supply chain, and that upheaval is opening a new growth chapter for Taiwan's LED industry. As Taiwan's LED makers move away from the price wars of the consumer market, Nvidia's push to upgrade AI transmission standards to 1.6T, 3.2T, and beyond is exposing the physical limits of copper wiring, making scale-up the first battlefield in the co
2026-06-17
news.google.com
2026-06-17
Insider Monkey
2026-06-14
news.google.com
2026-06-14
IndexBox
2026-06-12
digitimes.com
2026-06-12
The artificial intelligence (AI) industry is expanding at a pace that the physical world cannot match, and the gap between digital demand and real-world supply is widening across every layer of the infrastructure stack, from power generation to chip manufacturing to data center construction. That was the assessment of Sachin Hindupur, global strategy and operations leader at AMD, in a presentation
2026-06-12
digitimes.com
2026-06-12
As wide-bandgap (WBG) semiconductors like silicon carbide (SiC) and gallium nitride (GaN) take the lead in electric vehicle (EV) powertrains, electronics packaging engineers are facing a thermodynamic reckoning. To extract maximum performance from these high-frequency, high-efficiency chips, the industry is driving an architectural shift: shrinking inverter volumes, eliminating heavy copper basepl
2026-06-12
digitimes.com
2026-06-12
Taiwan's semiconductor and electronics supply-chain companies continued to post generally firm sales in May, according to monthly revenue data and company disclosures, with the strongest accumulated growth concentrated in AI-linked logic, testing, substrate, and copper-clad laminate suppliers.
2026-06-11
digitimes.com
2026-06-11
AI infrastructure demand is lifting high-end PCB orders, but fresh bottlenecks are emerging in the upstream copper-clad laminate (CCL) supply chain. T-glass glass fiber cloth remains tight after disrupting the high-end ABF substrate market. HVLP4 copper foil is set to become the next constraint in the second half of 2026.
2026-06-10
digitimes.com
2026-06-10
GEM Terminals reported consolidated revenue of about NT$428 million (US$13.6 million) in May 2026, up 71.83% year-over-year from NT$249 million, saying expanding global investment in AI infrastructure drove a surge in demand for specialty copper materials used in cooling applications. The firm linked the month's performance to rising cooling needs at servers and data centers as computing density i
2026-06-10
digitimes.com
2026-06-10
Co-Tech said on June 8, 2026, that Nvidia has directly approached it to discuss long-term capacity planning for high-end HVLP4 copper foil, as AI GPU and ASIC demand accelerates and a structural supply bottleneck looms in 2026. Chairman Frank Lee said the market could face a 15–25% supply shortfall in 2026, setting up a two-to-three year upcycle in prices.