Semiconductor News & Analysis Feed

South Korean equipment maker Hanmi Semiconductor is moving beyond high-bandwidth memory (HBM) tools into advanced chip packaging, a shift that could affect the global semiconductor supply chain. As ASE boosts capacity to meet TSMC-linked demand, Hanmi is positioning for broader sales growth in the second half of 2026 and beyond.

Nvidia and other artificial intelligence chipmakers are still facing shortages as TSMC's advanced-node and CoWoS packaging capacity remains tight, pushing demand into foundries, back-end assembly, testing, and overseas fabs. The strain is creating spillover opportunities across the broader semiconductor supply chain, while also exposing how dependent the market has become on limited high-end capac

TSMC, TW0002330008 Capacity push for AI: TSMC’s CoWoS packaging ramps toward 140,000 wafers a month 16.06.2026 - 02:00:19 | ad-hoc-news.de TSMC’s CoWoS advanced packaging line is emerging as a quiet workhorse of the AI boom. Industry data now points to capacity as high as 120,000 to 140,000 wafers per month by 2026, as the Taiwanese foundry pours billions into a technology that has become critica