digitimes.com
2026-05-28
Advanced Semiconductor Engineering (ASE) has unveiled its industry-first automated panel-level packaging (PLP) system, a development poised to reshape global artificial intelligence (AI) and high-performance computing supply chains by significantly improving chip integration speeds and manufacturing efficiency for AI data centers and cloud infrastructure providers.
ir.supermicro.com
2026-05-27
Supermicro
SAN JOSE, Calif., May 27, 2026 /PRNewswire/ -- Super Micro Computer, Inc. (NASDAQ: SMCI), an AI, Enterprise, Storage, and 5G/Edge Total IT Solution Provider featuring Data Center Building Block Solutions® (DCBBS), today announced that Verda, a leading European AI cloud provider, has selected Supermicro's NVIDIA GPU-accelerated, rack-scale systems to power its modern AI cloud infrastructure across