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Anthropic's reported move into in-house chip development could matter well beyond Silicon Valley if it helps lower the cost of running AI services worldwide. By prioritizing cheaper inference rather than elite performance, the startup may be signaling a more pragmatic path that could influence how global AI systems are built and priced.

Alibaba Group's semiconductor design arm T-Head has more than tripled its registered capital, underscoring the Chinese technology giant's growing focus on artificial intelligence infrastructure and domestic chip development.

Cloud service providers are accelerating in-house AI chip development, lifting demand for application-specific integrated circuits, or ASICs, and reshaping collaboration across the semiconductor supply chain.

United States/Semiconductors/NasdaqGS:INTC Intel (INTC) And UMC Team Up On 12nm And 3nm Chip Development June 23, 2026 Simply Wall St Reviewed by Bailey Pemberton Intel (NasdaqGS:INTC) and United Microelectronics Corporation have agreed to jointly develop 12nm and 3nm chip manufacturing processes. The collaboration will use Intel’s Arizona facilities as part of the company’s IDM 2.0 foundry strate

DEEPTECH Venture Kick backs Minysa with €163K for GaN chip development Minysa has secured funding from Venture Kick to advance gallium nitride control chips designed for high-reliability applications, including space systems, robotics, and industrial electronics. Tamara Djurickovic 18 June 2026 Swiss electronics startup Minysa has secured €163,000 (CHF150,000) from Venture Kick to accelerate

Pokde.Net > System > Software > AI > Cadence ChipStack AI Super Agent Achieves Full Autonomy For Chip Development AI NEWS SOFTWARE SYSTEM Cadence ChipStack AI Super Agent Achieves Full Autonomy For Chip Development Last updated: June 16, 2026 9:23 pm By Low Boon Shen Share 2 Min Read Earlier in COMPUTEX 2026, Cadence announced the extension of its ChipStack AI Super Agent to Level-5 autonomy, des

MAtek reported May 2026 revenue of NT$544 million (US$17.23 million), a 26.87% increase year-over-year and a 0.69% increase month-over-month, marking its third consecutive month of record sales, the firm announced. For the first five months of 2026, revenue reached NT$2.51 billion, up 19.01% from the same period in 2025, with the company's leadership attributing growth to demand for outsourced mat

Home / ICV / NIO, GigaDevice forge strategic alliance to advance automotive chip development NIO NIO, GigaDevice forge strategic alliance to advance automotive chip development Monika From Gasgoo | June 5 , 2026 19:38 BJT f SHARE TWEET in SHARE SHARE Gasgoo Munich- Chinese semiconductor supplier GigaDevice and electric vehicle maker NIO have entered into a strategic partnership aimed at strengthe

Oppstar Bhd has restructured the delivery framework of an artificial intelligence chip development project with a Yokohama-based client, replacing an earlier tripartite arrangement with separate design services agreements and formalizing a US$2.9 million contract for its engineering scope, according to The Edge Malaysia.

Infineon’s, Moore4Power Infineon’s €91M Moore4Power Project Aims to Slash Chip Development Time as Stock Flirts with Overbought Levels 28.05.2026 - 22:01:16 | boerse-global.de Infineon launches Moore4Power consortium to cut fab-to-datasheet time to one week, restructures into three segments, as stock hits records but overbought signals warn of consolidation. Infineon’s €91M Moore4Power Project A

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Applied Materials and TSMC have announced a partnership to accelerate semiconductor technologies for AI, aiming to speed commercialization and improve the energy efficiency of chips spanning data centers and edge devices. The collaboration promises...The article requires paid subscription.Subscribe Now