Semiconductor News & Analysis Feed

This article highlights a new critical bottleneck in the AI tech wave: chip packaging technology, particularly Chip on Wafer on Substrate (CoWoS). As AI applications evolve from basic search and execution functions to real-world physical tasks such as smart glasses, robots, and drones, demand for hi

Taiwan Semiconductor Manufacturing Company (TSMC), the world's most advanced chipmaker, has decided not to deploy ASML's latest high-numerical aperture (High-NA) extreme ultraviolet (EUV) lithography systems—priced at around $400 million each—until at least 2029. This move raises critical questions