1099 articles
2026-05-22
digitimes.com
2026-05-22
BOE Technology, China's leading display panel maker, is expanding its push into new businesses beyond panels. The company said on the evening of May 20 that it had signed a three-year memorandum of understanding with US glass materials supplier Corning to cooperate in glass-based packaging substrates, foldable glass, perovskite glass substrates and optical interconnects.
2026-05-22
digitimes.com
2026-05-22
AI-driven demand and other emerging technologies kept Taiwan's export momentum strong in the first quarter of 2026, with exports reaching US$195.74 billion, rising 51% year on year. Economic growth hit 13.69%, the highest quarterly growth in 39 years. Taiwan's GDP is forecast to reach NT$32 trillion (US$1.02 trillion) in 2026.
2026-05-22
digitimes.com
2026-05-22
Broadcom, Applied Materials, GlobalFoundries, Meta, and Synopsys are partnering with UCLA Samueli to create a US$125 million Semiconductor Hub to accelerate research and workforce development in AI-driven chip technologies, promising global impacts on computing speed, energy efficiency, and applications from healthcare to transportation while strengthening US competitiveness and innovation globall
2026-05-22
digitimes.com
2026-05-22
Tata Group's semiconductor facility in Assam is expected to begin production soon, marking a significant milestone in India's push to build a domestic semiconductor manufacturing industry and strengthen its standing in global technology supply chains.
2026-05-22
digitimes.com
2026-05-22
Intel CEO Lip-Bu Tan is reshaping the chipmaker's engineering culture and foundry strategy, confirming that 14A remains on track while revealing that early development has begun on next-generation 10A and 7A nodes.
2026-05-22
digitimes.com
2026-05-22
Microsoft is in early discussions to provide AI servers powered by its in-house Maia chips to Anthropic, deepening ties between the two companies as cloud providers race to reduce dependence on Nvidia hardware and secure a stronger position in the AI infrastructure market.
2026-05-22
digitimes.com
2026-05-22
Lam Research has opened a Panel-Level Packaging (PLP) Innovation Excellence Center in Salzburg, Austria, underscoring the company's move deeper into advanced packaging as customers explore panel-based processes. Aaron Fellis, corporate VP and GM of dielectric atomic layer deposition (ALD) products at Lam Research, said leading chip firms are testing PLP in R&D or alliances and that several custome
2026-05-22
digitimes.com
2026-05-22
Samsung Electronics chairman Lee Jae-yong quietly visited Taiwan on May 21 and met with MediaTek CEO Rick Tsai, according to semiconductor supply chain sources, in a move aimed at expanding Samsung's foundry business by securing another major customer after deals with Tesla and renewed work with AMD. Samsung declined to comment, and MediaTek had not issued an official response by press time.
2026-05-22
www.bloomberg.com
2026-05-22
Bloomberg.com
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2026-05-22
digitimes.com
2026-05-22
AMD CEO Lisa Su said the company is satisfied with its current CoWoS supply from TSMC, while noting that memory has become another pressure point in the AI chip supply chain.
2026-05-22
www.livenowfox.com
2026-05-22
LiveNOW from FOX
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2026-05-22
www.quiverquant.com
2026-05-22
Quiver Quantitative
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2026-05-22
cryptobriefing.com
2026-05-22
Crypto Briefing
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2026-05-22
www.benzinga.com
2026-05-22
Benzinga
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2026-05-22
www.msn.com
2026-05-22
MSN
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2026-05-22
cryptobriefing.com
2026-05-22
Crypto Briefing
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2026-05-22
seekingalpha.com
2026-05-22
Seeking Alpha
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2026-05-22
www.ien.com
2026-05-22
Industrial Equipment News
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2026-05-22
blogs.sjsu.edu
2026-05-22
SJSU Blogs
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2026-05-22
news.google.com
2026-05-22
AD HOC NEWS
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