Semiconductor News & Analysis Feed

4533 articles
2026-05-25
stratnewsglobal.com 2026-05-25 StratNews Global
Home Asia Huawei Unveils New Chip Design Amid Semiconductor Push Huawei Unveils New Chip Design Amid Semiconductor Push By Team StratNews - May 25, 2026 Select Preferred on Google News Discover more Breaking News Alerts Huawei Technologies said on Monday that its advanced chips are expected to achieve transistor densities comparable to 1.4-nanometre process technology within the next five years
2026-05-25
www.huaweicentral.com 2026-05-25 Huawei Central
HUAWEI Huawei Kirin 2026 Chip: 238 MTr/mm2 transistor density rivaling TSMC’s 3nm Published 4 hours ago on May 25, 2026 By Deng Li Discover more Huawei FreeBuds Huawei software updates Vivo phone updates Huawei has revealed its Kirin 2026 details and it reveals massive upgrade in the chip arachitecture including transistor density. He Tingbo, Director and President of Semiconductor B
2026-05-25
www.cnbc.com 2026-05-25 CNBC
SHANGHAI — Chinese tech giant Huawei on Monday touted a new approach to developing advanced semiconductors despite U.S. sanctions, as Nvidia struggles to sell its high-end chips in China. Huawei said it developed a new engineering approach called “LogicFolding” to manufacture its Kirin smartphone chips this fall. That breakthrough comes as Nvidia faces U.S. export restrictions in China and App
2026-05-25
www.digitimes.com 2026-05-25 digitimes
Nvidia's structural pivot to isolate its ACIE market and AMD's US$10 billion investment in Taiwan infrastructure signal a profound realignment in the AI chip war. Both developments reflect a shared urgency to expand beyond traditional hyperscale clouds into... Some subscribers prefer to save their log-in information so they do not have to enter their User ID and Password each time
2026-05-25
www.investing.com 2026-05-25 Investing.com
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2026-05-25
startupfortune.com 2026-05-25 Startup Fortune
Home › Ai › Huawei says its chip plan can narrow the gap with TSMC Huawei says its chip plan can narrow the gap with TSMC AI / BUSINESS | Huawei says it expects to design high-end chips by 2031 with transistor density equivalent to 1.4-nanometre manufacturing. The claim does not erase TSMC's lead, but it gives China's AI hardware push a clearer roadmap and adds pressure to Nvidia's China strategy
2026-05-25
www.devdiscourse.com 2026-05-25 Devdiscourse
UPDATE 2-China's Huawei reveals chip design breakthrough amid US sanctions Huawei's Ascend chip series has become increasingly central to powering ⁠Chinese AI ​models, including DeepSeek's latest flagship model V4, released last month. Huawei ⁠said its Kirin chips scheduled to launch later this year would be the first to use a related architecture called LogicFolding, which the company said would
2026-05-25
www.heygotrade.com 2026-05-25 Gotrade
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2026-05-25
www.techinasia.com 2026-05-25 Tech in Asia
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2026-05-25
www.businesstimes.com.sg 2026-05-25 The Business Times
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2026-05-25
www.businesstimes.com.sg 2026-05-25 The Business Times
China’s Huawei reveals chip design breakthrough amid US sanctions The company’s Ascend chip series has become increasingly central to powering Chinese artificial intelligence models Summarise Share Add BT as a preferred source Published Mon, May 25, 2026 · 10:10 AM — Updated Mon, May 25, 2026 · 01:24 PM Huawei unveiled on Monday a new principle for improving chips, noting the industry can no l
2026-05-25
www.tradingview.com 2026-05-25 TradingView
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2026-05-25
www.techinasia.com 2026-05-25 Tech in Asia
A member of The Business Times. Copyright © 2026 Tech in Asia. All Rights Reserved. Tata Electronics plans to start chip packaging for global automotive and industrial clients at its new OSAT plant in Jagiroad, Assam, ahead of a wider ramp-up later this year, people familiar with the matter said. OSAT, or outsourced semiconductor assembly and test, refers to packaging, testing, and inspection af
2026-05-25
theedgemalaysia.com 2026-05-25 The Edge Malaysia
(May 25): Huawei Technologies Co said it has come up with a new pathway to shorten its gap with industry leader Taiwan Semiconductor Manufacturing Co (TSMC), potentially achieving a breakthrough in making advanced semiconductors without cutting-edge equipment. Right now there is about a five-year gap between what TSMC is capable of and what Huawei together with its manufacturing partner Semicondu
2026-05-25
www.reuters.com 2026-05-25 Reuters
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2026-05-25
www.marketscreener.com 2026-05-25 marketscreener.com
Access Denied You don't have permission to access "http://www.marketscreener.com/news/huawei-proposes-new-path-for-chip-development-amid-us-sanctions-ce7f5adcd18df427" on this server. Reference #18.860ed217.1779758561.7b964c8c https://errors.edgesuite.net/18.860ed217.1779758561.7b964c8c
2026-05-25
www.scmp.com 2026-05-25 South China Morning Post
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2026-05-25
www.bloomberg.com 2026-05-25 Bloomberg.com
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2026-05-25
www.bloomberg.com 2026-05-25 Bloomberg.com
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2026-05-25
www.wsws.org 2026-05-25 World Socialist Web Site
West Lafayette, Indiana government fast-tracks SK Hynix memory chip factory construction George Kirby, Kevin Reed 9 hours ago As residents of West Lafayette, Indiana continue their fight to stop the construction of the SK Hynix microchip factory and reverse the rezoning of their neighborhood, local politicians are moving swiftly to assist the South Korean-based semiconductor corporation and its P