Semiconductor News & Analysis Feed
7394 articles
2026-07-10
digitimes.com
2026-07-10
E&R Engineering says AI demand and faster-than-expected glass substrate adoption are tightening equipment supply and advancing investment plans across Asia and the US. For global chip makers, the shift could accelerate next-generation packaging capacity, reshape supplier spending, and bring advanced process tools into volume production sooner than expected.
2026-07-10
digitimes.com
2026-07-10
Nvidia has denied reports that its next-generation Kyber AI rack system could be delayed to 2028, saying its product roadmap remains unchanged, after SemiAnalysispointed to manufacturing challenges in a key PCB midplane as a potential bottleneck for the Rubin Ultra platform.
2026-07-10
digitimes.com
2026-07-10
China's graduate job market is shifting toward semiconductors, materials, and manufacturing, with global implications for supply chains, AI development, and critical minerals. Fresh salary data show computer science and software engineering losing ground as strategic industries draw more talent, while hard tech majors gain pay advantages across the country.
2026-07-10
digitimes.com
2026-07-10
GlobalWafers and Micron have signed a 10-year supply agreement, alongside US$500 million in strategic financial support, in a move that underscores how artificial intelligence (AI), high-performance computing (HPC), data centers, and advanced memory demand are reshaping semiconductor sourcing. The deal extends US supply chain localization beyond wafer production and into upstream critical material
2026-07-10
digitimes.com
2026-07-10
Nanya Technology posted record quarterly profit after a more than 60% rise in average DRAM selling prices lifted its gross margin to 79.5%, with the Taiwanese memory chipmaker expecting prices and margins to improve further in the second half.
2026-07-10
digitimes.com
2026-07-10
For most of its modern history, India's Northeast — the eight states anchored by Assam — has sat at the margins of the country's industrial economy. That is beginning to change, as a mix of federal industrial incentives, a flagship semiconductor packaging plant in Assam, and deepening ties with Japan give the region a modest but real foothold in India's electronics ambitions.
2026-07-10
digitimes.com
2026-07-10
LG Innotek is moving ahead with a new semiconductor substrate manufacturing facility in Vietnam, marking its first overseas production base for IC substrates as the company seeks to expand capacity for advanced packaging products used in AI servers and high-end mobile devices.
2026-07-10
digitimes.com
2026-07-10
Apple and Broadcom have extended their custom-chip partnership through 2031 under agreements expected to exceed US$30 billion, reinforcing Broadcom's position as a critical Apple chip supplier.
2026-07-10
digitimes.com
2026-07-10
Largan said on July 9, 2026, that it will formally begin sampling fiber array (FA) products for a mass-production customer in July, while chairman En-Ping Lin outlined the company's advantages in common packaging optics (CPO) amid market attention on Corning's Glass Bridge technology.
2026-07-10
digitimes.com
2026-07-10
Global Mixed-mode Technology reported June revenue of NT$743 million (US$23.16 million), down 0.71% from May but up 7.19% from a year earlier. The Taiwanese PMIC maker said second-quarter revenue reached NT$2.238 billion, up 5.99% from the first quarter and down 0.46% year on year, while first-half revenue totaled NT$4.349 billion, a 1.30% decline from a year earlier.
2026-07-10
digitimes.com
2026-07-10
Mitsubishi Chemical and Japan Steel Works are preparing a fresh capacity expansion in gallium nitride (GaN) substrates, aiming to capture growing demand from next-generation power semiconductors used in EVs, inverters and data center power systems.
2026-07-10
digitimes.com
2026-07-10
Micron Technology's decision to lift its planned US investment to more than US$ 250 billion through 2035, unveiled July 9 alongside the first concrete pour at its Clay, New York, site, is fundamentally a bet on where the AI era's most contested commodity, memory, will be manufactured.
2026-07-10
digitimes.com
2026-07-10
Meta Platforms plans to begin manufacturing its Iris AI accelerator in September 2026 while securing long-term supplies of memory, storage and optical equipment for a computing expansion expected to reach 14 gigawatts in 2027.
2026-07-10
digitimes.com
2026-07-10
ASML, Imec and TSMC are collaborating in southern Taiwan to develop manufacturing equipment for two-dimensional (2D) semiconductor materials, marking a significant step toward commercializing technologies widely viewed as essential for extending Moore's Law beyond the limits of conventional silicon scaling.
2026-07-10
digitimes.com
2026-07-10
JCET plans to invest about CNY10 billion (approx. US$1.4 billion) in fixed assets in 2026, sharply increasing spending on AI-driven advanced packaging, automotive electronics and selected mainstream packaging capacity while its major Chinese plants run on strong orders.
2026-07-10
digitimes.com
2026-07-10
Realtek Semiconductor reported June 2026 revenue of NT$12.31 billion (approx. US$383.67 million), down 1.7% from the previous month but up 20.6% from a year earlier. Second-quarter 2026 revenue totaled NT$37.55 billion, rising 3.11% sequentially and 17.68% year-over-year, while first-half 2026 revenue reached NT$73.98 billion, up 10.52% from the same period last year. Both second-quarter and first
2026-07-10
digitimes.com
2026-07-10
China moved on July 10 to wall off its domestic supply of helium, a gas with no substitute in chipmaking and medical imaging, in a step that suggests Beijing does not expect Middle East supply risks to ease quickly — and one that could tighten an already strained global market.
2026-07-10
digitimes.com
2026-07-10
SK Hynix has priced a US$26.5 billion Nasdaq offering, giving the world's leading supplier of high-bandwidth memory fresh capital to expand DRAM wafer production, advanced packaging and leading-edge manufacturing equipment at the same time.
2026-07-10
digitimes.com
2026-07-10
GigaDevice Semiconductor expects first-half 2026 net profit to reach about CNY6.9 billion (US$960 million), a 1,099% increase from a year earlier, after tight memory chip supply lifted both shipment volumes and prices.
2026-07-10
digitimes.com
2026-07-10
Samsung Electronics, SK Hynix and Micron Technology are taking different manufacturing paths for the logic base die in HBM4, opening a new front in the competition over advanced memory performance, yield and supply.