Semiconductor News & Analysis Feed
2360 articles
2026-05-27
digitimes.com
2026-05-27
WinWay Technology's orders are already booked out five to six months in advance, says company Chairman Mark Wang. He expects new production capacity coming online at the company's Kaohsiung facilities to gradually ease supply shortages and help drive record monthly and quarterly revenue growth throughout the second half of 2026.
2026-05-27
digitimes.com
2026-05-27
Wah Lee Industrial said it has formally moved into investments in standard gases and other supplies needed by wafer fabs, with its Tainan logistics center set to open in the second half of 2026 to support future growth. Chairman Gary Chang also confirmed that the company will pass on higher costs for semiconductor and PCB products quarterly as raw material prices climb.
2026-05-27
digitimes.com
2026-05-27
Samsung Electronics plans to invest VND39 trillion (approx. US$1.5 billion) in a new semiconductor testing facility in northern Vietnam, according to documents reviewed by Reuters,marking the company's first chip testing plant in the country as global memory demand surges amid the AI boom.
2026-05-27
digitimes.com
2026-05-27
Taiwan Semiconductor Manufacturing Company (TSMC) is scheduled to hold a company-wide communication meeting on the morning of May 27, during which chairman C.C. Wei is expected to explain in person the latest employee bonus policy, following online backlash over reports that the company will cut employee bonuses by 15%.
2026-05-27
digitimes.com
2026-05-27
Huawei's Tau Law proposal is rapidly redirecting attention across China's semiconductor industry away from pure lithography competition and toward advanced packaging, 3D stacking, optical interconnects, and system-level architecture design.
2026-05-27
digitimes.com
2026-05-27
Nvidia CEO Jensen Huang, who is visiting Taiwan for two weeks, stated that the island's manufacturing sector is developing rapidly and needs more electricity.
2026-05-27
digitimes.com
2026-05-27
Samsung Electronics' 2026 tentative labor-management agreement is expected to pass after already surpassing an 86% voting participation rate within just three days. While the agreement has temporarily eased concerns over potential strikes, South Korea's semiconductor industry is increasingly worried that the newly expanded performance bonus structure, which guarantees employees a fixed percentage
2026-05-27
digitimes.com
2026-05-27
China has formally brought AI chips into its national security and reliability evaluation framework for the first time, marking a further expansion of the country's Information Technology Application Innovation procurement policy into AI computing infrastructure.
2026-05-27
digitimes.com
2026-05-27
Qualcomm has reached a deal to supply AI data center chips to ByteDance, giving the US smartphone processor designer a potentially high-volume customer as it tries to expand into AI infrastructure and custom silicon.
2026-05-27
digitimes.com
2026-05-27
Taiwan-based Daxin Materials posted stronger revenue and profitability in 2025 as rapid growth in semiconductor materials offset a still-cautious display market recovery, with AI- and HPC-driven demand emerging as the company's primary growth engine.
2026-05-27
digitimes.com
2026-05-27
Samsung Electronics' tentative 2026 wage agreement has cleared a union vote with 73.7% approval, moving a months-long labor dispute closer to settlement while exposing a deeper divide between workers in the company's chip and consumer electronics businesses, according to Korean media reports.
2026-05-27
digitimes.com
2026-05-27
US efforts to rebuild its semiconductor supply chain are exposing a critical gap in domestic packaging and testing capacity, a bottleneck that industry sources expect to ease only after 2028 as the US OSAT ecosystem gradually takes shape.
2026-05-27
digitimes.com
2026-05-27
The agreement between Qualcomm and ByteDance positions the former for large-scale AI ASIC demand from the latter, as reported by Bloomberg, but market viability remains uncertain amid intense AI chip competition, evolving China procurement preferences, and regulatory pressures affecting cross-border semiconductor adoption.
2026-05-27
digitimes.com
2026-05-27
SmartSens and Unisoc have formed a strategic partnership to develop Micro LED high-speed optical interconnects, aiming to deliver domestic, low-power, high-bandwidth solutions for short-reach AI cluster links. The collaboration could accelerate the commercialization of Micro LED co-packaged optics (CPO) technology and strengthen China's role in global AI infrastructure supply chains, according to
2026-05-27
www.digitimes.com
2026-05-27
digitimes
Huawei's Tau Law proposal is rapidly redirecting attention across China's semiconductor industry away from pure lithography competition and toward advanced packaging, 3D stacking, optical interconnects, and system-level architecture design.
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2026-05-27
www.gurufocus.com
2026-05-27
GuruFocus
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2026-05-27
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2026-05-27
InvestmentNews
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2026-05-27
marklapedus.substack.com
2026-05-27
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Europe Launches New Chip/Packaging R&D Projects
These projects include GaN/SiC packaging, quasi-monolithic integration, 3D qub
2026-05-27
developer.nvidia.com
2026-05-27
NVIDIA Developer
NVIDIA CompileIQ tackles one of the hardest problems in performance engineering: finding the compiler options that unlock the best performance for a specific workload.
Consider a team that has spent weeks optimizing an LLM inference pipeline on GPUs, tuning batch sizes, quantizing to FP8, adopting flash attention, fusing every kernel they can. The profiler says there’s nothing left to squeeze.
B
2026-05-27
www.marketwatch.com
2026-05-27
MarketWatch
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