www.prnewswire.com
2026-05-27
LG Innotek made its debut at the 2026 Electronic Components and Technology Conference (ECTC), showcasing next-generation semiconductor package substrate technologies to global industry leaders. As the world’s largest international conference on semiconductor packaging, ECTC attracted over 2,000 prof
www.morningstar.com
2026-05-27
LG Innotek announced its participation in the 2026 Electronic Components and Technology Conference (ECTC) in Orlando, Florida, where it showcased next-generation semiconductor package substrate technologies to global tech leaders. ECTC, the world's largest international conference on semiconductor p