Semiconductor News & Analysis Feed

9288 articles
2026-06-15
memeburn.com 2026-06-15 Memeburn
TL;DR Nvidia hired Bruce Andrews, Intel's former government affairs chief and Obama-era Commerce Department official, as its new Chief External Affairs Officer. The chipmaker's lobbying expenditures surged from $640,000 in 2024 to nearly $5 million in 2025, roughly a 670% increase. Andrews' appointment comes amid tighter US chip export controls, a June 2026 crackdown on Chinese subsidiary loophol
2026-06-15
www.ad-hoc-news.de 2026-06-15 AD HOC NEWS
Infineon’s, Dresden Infineon’s €5B Dresden Fab Opens Early as China GaN Sales Ban Clouds Outlook 15.06.2026 - 04:13:47 | boerse-global.de Infineon opens €5B Dresden smart-power fab ahead of schedule, but a Chinese patent ruling bans its GaN products, forcing a strategic pivot amid booming AI and EV demand. Infineon’s - Infineon’s €5B Dresden Fab Opens Early as China GaN Sales Ban Clouds Outlook
2026-06-15
news.google.com 2026-06-15 AASTOCKS.com
2026-06-15
www.aastocks.com 2026-06-15 AASTOCKS.com
HBM HOLDINGS-B (02142.HK)  +0.450 (+4.487%)    Short selling $6.89M; Ratio 22.802%   opened 1.99% higher today, reaching an intraday peak of HKD10.58. It is now trading at HKD10.54, up 5.08%, with turnover of 0.739 million shares, involving HKD7.7142 million. Data Last Update: 2026/06/15 10:26 HBM HOLDINGS-B Cumulative performance   -13.82% YTD   -18.19% 1-Month Data Last Update: 2026/06/1
2026-06-15
news.google.com 2026-06-15 AASTOCKS.com
2026-06-15
www.indexbox.io 2026-06-15 IndexBox
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2026-06-15
www.thefastmode.com 2026-06-15 The Fast Mode
KKR, together with the Kuwait Investment Authority (KIA), NVIDIA and Vistra announced the launch of Helix Digital Infrastructure (Helix), a new company designed to deliver integrated infrastructure at the speed and scale required for hyperscalers to meet accelerating artificial intelligence (AI) demand.  As building AI infrastructure becomes increasingly complex, Helix will serve as a single coor
2026-06-15
www.tweaktown.com 2026-06-15 TweakTown
Google is in talks with Samsung to build next-gen 'Icefish' TPU on 1.4nm and 2nm process split Google's Icefish TPU may be split between Samsung and TSMC, with 1.4nm compute dies and 2nm memory I/O targeting a 2028 production timeline. VIEW GALLERY - 3 Hassam Nasir Tech Reporter Published Jun 14, 2026 8:30 PM CDT 2-minute read time TL;DR: Google is reportedly planning a multi-foundry strategy fo
2026-06-15
www.techtimes.com 2026-06-15 Tech Times
By Allen Lee Published: Jun 14 2026, 20:42 PM EDT Share on Facebook Share on Twitter Share on LinkedIn Share on Reddit Share on Flipboard Share on Pocket Tower cranes are seen at the construction site of the Samsung Electronics factory in Pyeongtaek on May 28, 2026. SHIN YONG-JU/AFP VIA GETTY IMAGES Samsung Electronics expects its foundry business to return to annual profitability in 2028 — late
2026-06-15
www.techtimes.com 2026-06-15 Tech Times
By Allen Lee Published: Jun 14 2026, 20:42 PM EDT Share on Facebook Share on Twitter Share on LinkedIn Share on Reddit Share on Flipboard Share on Pocket Tower cranes are seen at the construction site of the Samsung Electronics factory in Pyeongtaek on May 28, 2026. SHIN YONG-JU/AFP VIA GETTY IMAGES Samsung Electronics expects its foundry business to return to annual profitability in 2028 — late
2026-06-15
news.google.com 2026-06-15 Tech Times
2026-06-15
www.indexbox.io 2026-06-15 IndexBox
This website is using a security service to protect itself from online attacks. The action you just performed triggered the security solution. There are several actions that could trigger this block including submitting a certain word or phrase, a SQL command or malformed data. You can email the site owner to let them know you were blocked. Please include what you were doing when this page came u
2026-06-15
digitimes.com 2026-06-15
Tsang Yow is preparing to broaden its manufacturing footprint in Malaysia, a move that could help global semiconductor supply chains become more regional, resilient, and tariff-proof. The drivetrain systems maker expects trial production at the new plant before the end of 2026, as demand tied to artificial intelligence and advanced chips reshapes sourcing patterns worldwide.
2026-06-15
digitimes.com 2026-06-15
SK Hynix is bringing additional back-end equipment into its Cheongju P&T6 facility as it steps up mass-production preparations for HBM4, a move that underscores mounting pressure on advanced memory suppliers to keep pace with demand from AI infrastructure.
2026-06-15
digitimes.com 2026-06-15
Tata Electronics' planned US$11 billion semiconductor fab in Dholera, Gujarat, has become the anchor of India's front-end chip manufacturing ambitions. The project, supported by technology from Taiwan's PSMC, has also drawn a strategic partnership with Dutch lithography equipment supplier ASML.
2026-06-15
digitimes.com 2026-06-15
Nvidia CEO Jensen Huang's recent trip to South Korea put the spotlight on the rivalry between Samsung Electronics and SK Hynix, while memory giant Micron crossed the US$1 trillion market-cap mark for the first time. That shift has also drawn global attention to Micron CEO Sanjay Mehrotra, whose rise began with a string of dramatic visa rejections 50 years ago.
2026-06-15
digitimes.com 2026-06-15
South Korea's semiconductor equipment supply chain saw a material pickup in orders in the first half of 2026 as Samsung Electronics and SK Hynix accelerated investment in advanced DRAM and high-bandwidth memory (HBM4), generating demand across front-end tools, advanced packaging, and inspection equipment. The shift toward high-end process and packaging capabilities for AI memory has driven new con
2026-06-15
digitimes.com 2026-06-15
India sees rising global tech investment as Meta, Reliance and Anthropic deepen AI ties, while EV firms expand, Starlink faces delays, and semiconductor and tablet markets show steady structural growth.
2026-06-15
semiengineering.com 2026-06-15 Ed Sperling
Chip and system designers scramble to leverage existing and future standards as edge AI...
2026-06-15
digitimes.com 2026-06-15
As global semiconductor supply chains are rebuilt, Southeast Asia is evolving from a back-end test-and-pack region into a resilient, multi-center advanced packaging and equipment ecosystem, according to industry participants. Migration drivers include pushes for local production and service, faster ramps for AI chip capacity, and customer demands for supply chain resilience amid de-Americanization