Semiconductor News & Analysis Feed

Taiwan's passive component suppliers are entering the second half of 2026 with stronger order momentum, as demand from AI data centers, networking equipment, power systems, and automotive electronics helps offset earlier pressure from volatile metal prices and weaker consumer electronics planning.

JCET Group is accelerating its AI chip packaging expansion with a CNY7.8 billion (US$1.1 billion) investment in a new advanced packaging and testing plant in Shanghai Lingang, strengthening capacity for AI computing, high-performance chips, high-density memory and automotive electronics.

Walsin Technology expects the tight supply of passive components could last into 2028, as demand from AI infrastructure, automotive electronics, and future device upgrades lifts orders while memory shortages weigh on shipments across the broader electronics supply chain.