Semiconductor News & Analysis Feed
313 articles
2026-06-15
digitimes.com
2026-06-15
Equipment maker Manz recently announced the successful delivery of the world's first 310mm x 310mm panel-level packaging (PLP) electrochemical deposition (ECD) mass-production tool, further expanding its footprint in advanced packaging process equipment and demonstrating integrated capabilities spanning in-house R&D, process and system integration, and mass-production deployment.
2026-06-15
digitimes.com
2026-06-15
South Korea's semiconductor equipment supply chain saw a material pickup in orders in the first half of 2026 as Samsung Electronics and SK Hynix accelerated investment in advanced DRAM and high-bandwidth memory (HBM4), generating demand across front-end tools, advanced packaging, and inspection equipment. The shift toward high-end process and packaging capabilities for AI memory has driven new con
2026-06-15
digitimes.com
2026-06-15
As global semiconductor supply chains are rebuilt, Southeast Asia is evolving from a back-end test-and-pack region into a resilient, multi-center advanced packaging and equipment ecosystem, according to industry participants. Migration drivers include pushes for local production and service, faster ramps for AI chip capacity, and customer demands for supply chain resilience amid de-Americanization
2026-06-14
www.digitimes.com
2026-06-14
digitimes
Chunghwa Leading Photonics Tech, a subsidiary of Chunghwa Telecom, is set to list on the Taipei Emerging Stock Board. The company has recorded record-high revenue and gross margin in the first four months of 2026, boosted by rising demand in Industry 5.0...
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2026-06-14
digitimes.com
2026-06-14
Chunghwa Leading Photonics Tech, a subsidiary of Chunghwa Telecom, is set to list on the Taipei Emerging Stock Board. The company has recorded record-high revenue and gross margin in the first four months of 2026, boosted by rising demand in Industry 5.0 applications, advanced semiconductor process inspection, and AI data center optical communication. With short-wave infrared (SWIR) transmissive a
2026-06-12
www.quiverquant.com
2026-06-12
Quiver Quantitative
Amkor Technology, Inc. (AMKR) is up 7.6% today. Here is some analysis on what might have caused this price movement.
Analysis: The day’s specific catalyst is not clearly identifiable from widely circulated company news, but the move appears consistent with renewed optimism around Amkor’s advanced packaging roadmap and multi-year growth targets discussed recently. This could also be momentum tied
2026-06-12
mezha.ua
2026-06-12
Mezha
mezha.ua
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2026-06-12
news.futunn.com
2026-06-12
富途牛牛
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2026-06-12
www.electronicsforyou.biz
2026-06-12
Electronics For You BUSINESS
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2026-06-12
digitimes.com
2026-06-12
Sigurd announced that its May revenue reached a historic high, driven by overseas customer expansion, stronger demand for AI-related chips, and rising use of advanced packaging capacity. The result suggests continued momentum in global semiconductor supply chains, with implications for networking, memory, and high-performance computing markets worldwide.
2026-06-12
digitimes.com
2026-06-12
Samsung Electronics is regaining ground in high-bandwidth memory and foundry services, but advanced packaging remains a weak point in its bid to capture a larger share of the AI chip supply chain, according to industry sources and Korean media reports.
2026-06-12
digitimes.com
2026-06-12
The global push for AI and HPC chips is tightening advanced packaging capacity and lifting orders for outsourced semiconductor assembly and test providers. For international customers and supply chains, the shift suggests stronger demand for Taiwan's packaging and testing firms, alongside a broader rebalancing of semiconductor production.
2026-06-11
news.futunn.com
2026-06-11
富途牛牛
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2026-06-10
en.clickpetroleoegas.com.br
2026-06-10
CPG Click Petróleo e Gás
3 min of reading
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Samsung eyes strategic chip factory in South Korea and could shake up the global AI landscape with advancements in HBM memories and advanced packaging.
Written by
Caio Aviz
Published on
10/06/2026 at 08:11
Artificial Intelligence (AI)
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Possible investment in Gwangju could place Samsu
2026-06-10
www.moomoo.com
2026-06-10
Moomoo
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智通财经APP获悉，光大证券发布研报称，玻璃基板凭借其优异特性，逐步成为新一代先进封装介质。当前TGV玻璃基板正处于从实验室基础研究向量产工程化跨越的历史性节点，且呈国外进度领先、国内加速追赶态势。建议紧盯下游客户验证与量产线建
2026-06-10
theedgemalaysia.com
2026-06-10
The Edge Malaysia
Economy Minister Akmal Nasrullah Mohd Nasir (Photo by Shahrill Basri/The Edge)
GEORGE TOWN (June 10): The Advanced Packaging Institute and Research Centre (APIRC) aims to develop 12 local small and medium enterprises (SMEs) in the advanced packaging ecosystem and attract new investments worth RM8.5 billion by 2030.
Economy Minister Akmal Nasrullah Mohd Nasir said the target would be implemented
2026-06-10
www.astutegroup.com
2026-06-10
Astute Group
www.astutegroup.com
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2026-06-10
www.trendforce.com
2026-06-10
TrendForce
[News] Samsung May Announce New Gwangju Advanced Packaging Base by End-June Amid Capacity Expansion
2026-06-10 Semiconductors editor
News
Please note that this article cites information from Hankyung, New Daily, Reuters, and The Dong-A Ilbo.
Samsung Electronics is reportedly looking to expand its advanced packaging capacity. According to Hankyung, sources say the company is pursuing plan
2026-06-10
www.indexbox.io
2026-06-10
IndexBox
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2026-06-09
english.cw.com.tw
2026-06-09
天下雜誌
english.cw.com.tw
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