Semiconductor News & Analysis Feed

10433 articles
2026-05-26
www.digitimes.com 2026-05-26 digitimes
AI computing's massive demand for infrastructure is making interconnect and laser technologies key to overcoming power and bandwidth limits, prompting silicon photonics unicorn Lightmatter to unveil its latest laser product, Guide DR. To advance its... Some subscribers prefer to save their log-in information so they do not have to enter their User ID and Password each time they vis
2026-05-26
stocktwits.com 2026-05-26 Stocktwits
__fail__
2026-05-26
simplywall.st 2026-05-26 simplywall.st
__fail__
2026-05-26
simplywall.st 2026-05-26 simplywall.st
__fail__
2026-05-26
finance.yahoo.com 2026-05-26 Yahoo Finance
__fail__
2026-05-26
news.google.com 2026-05-26 The Globe and Mail
__fail__
2026-05-26
en.prnasia.com 2026-05-26 PR Newswire Asia
New High-speed Laser Marker delivers 2.5x higher chip throughput (units per hour) in a 22% smaller footprint, helping Outsourced Semiconductor Assembly & Test (OSAT) manufacturers drive productivity of valuable production floor space SINGAPORE, May 26, 2026 /PRNewswire/ -- IDI Dynamics, a subsidiary of ISDN Holdings Limited (SGX: I07 / 1656.HK), has launched its next generation High-speed Laser M
2026-05-26
biz.chosun.com 2026-05-26 Chosunbiz
By  Hwang Min-gyu Published 2026.05.26. 09:13 A concept diagram of iHBM technology released by SK hynix. /Courtesy of SK hynix SK hynix unveiled next-generation technology that reduces heat by inserting a cooling element inside a high bandwidth memory (HBM) package. On the 26th, SK hynix said it introduced "iHBM," a technology that embeds an integrated cooling element, ICE, in an HBM package. IC
2026-05-26
digitimes.com 2026-05-26
South Korea and the Netherlands are looking to broaden their semiconductor partnership beyond ASML's EUV lithography machines, as silicon photonics (SiPh) emerges as a potential next field of cooperation amid rising power and bandwidth demands from AI data centers.
2026-05-26
digitimes.com 2026-05-26
Nvidia CEO Jensen Huang is pushing the company deeper into the CPU market, betting that the rise of agentic AI will create a new growth engine beyond the GPUs that made Nvidia the dominant supplier of AI computing hardware.
2026-05-26
digitimes.com 2026-05-26
Kioxia is targeting 2027 production of its 10th-generation BiCS 10 NAND, a move that could help the Japanese memory maker narrow its technology gap with Samsung Electronics and SK Hynix as the South Korean rivals delay investment in their own next-generation NAND technologies, according to ZDNet Korea.
2026-05-26
digitimes.com 2026-05-26
Taiwan Semiconductor Manufacturing Company (TSMC) will reportedly cut employee bonuses by 15%, prompting some employees to voice dissatisfaction on social media. They argued that while TSMC's profits have soared, the share allocated to employee bonuses has decreased rather than increased, with some employees threatening to follow Samsung Electronics' union with a strike to fight for their rights.
2026-05-26
digitimes.com 2026-05-26
Powerchip announced it will present a "3D AI Foundry" showcase at COMPUTEX 2026 to demonstrate 3D wafer-on-wafer (WoW) DRAM stacking, interposers, and Si-cap integrated passive devices as part of an end-to-end offering for AI chips, addressing rising demand for GenAI and high-performance computing for memory capacity, bandwidth, and energy efficiency. The firm said it is leveraging its combined lo
2026-05-26
digitimes.com 2026-05-26
ADATA Technology said it will present a cloud-to-edge artificial intelligence ecosystem at COMPUTEX 2026, bringing together its enterprise storage brand TRUSTA, ADATA Industrial, gaming brand XPG, and AIoT unit ATrack to showcase hardware and software integrations across data centers, PCs, and edge devices. The company announced partnerships and cross-domain integrations with Nvidia, Intel, Advant
2026-05-26
digitimes.com 2026-05-26
Holy Stone Enterprise warns that AI-driven power upgrades are creating global shortages and record demand for multilayer ceramic capacitors (MLCCs), with lead times beyond 20 weeks and tighter supply expected through 2027. The developments could reshape supply chains for servers, data centers, and high-power consumer electronics worldwide, and accelerate global investment in components.
2026-05-26
digitimes.com 2026-05-26
As Micron Technology's decision to restart large-scale DDR4 production in the US grabs global attention, memory-chip executives and analysts say the move is less a revival of aging technology than a strategic reshuffling of supply aimed at safeguarding critical American industries.
2026-05-26
digitimes.com 2026-05-26
AI computing's massive demand for infrastructure is making interconnect and laser technologies key to overcoming power and bandwidth limits, prompting silicon photonics unicorn Lightmatter to unveil its latest laser product, Guide DR. To advance its 3D-stacked silicon photonics engine, Lightmatter is also working closely with TSMC using its Compact Universal Photonic Engine (COUPE) platform.
2026-05-26
digitimes.com 2026-05-26
GlobalWafers held its shareholders' meeting on May 25, where CEO Doris Hsu stated that the semiconductor market in 2026 has gradually moved beyond 2025's two extremes, when only AI and advanced process technologies dominated growth. In 2026, non-AI and traditional application markets began to recover, making market conditions thrive.
2026-05-26
digitimes.com 2026-05-26
Heat management has become a critical challenge as HBM technology advances, with higher stacking and faster speeds to meet surging global demand for AI data processing. Efficient control of power density in the die-to-die physical layer between HBM and GPUs is now central to next-generation HBM competitiveness and data center reliability.
2026-05-26
digitimes.com 2026-05-26
Following the conclusion of the Trump-Xi meeting and amid continued delays in China approving imports of Nvidia H20 GPUs, China's National Development and Reform Commission (NDRC) on May 22 sent a strong policy signal on artificial intelligence (AI) self-sufficiency, explicitly calling for greater efforts to pair domestic large language models with domestically developed computing chips.