Semiconductor News & Analysis Feed
10428 articles
2026-05-27
digitimes.com
2026-05-27
Samsung Electronics' tentative 2026 wage agreement has cleared a union vote with 73.7% approval, moving a months-long labor dispute closer to settlement while exposing a deeper divide between workers in the company's chip and consumer electronics businesses, according to Korean media reports.
2026-05-27
digitimes.com
2026-05-27
Qualcomm has reached a deal to supply AI data center chips to ByteDance, giving the US smartphone processor designer a potentially high-volume customer as it tries to expand into AI infrastructure and custom silicon.
2026-05-27
digitimes.com
2026-05-27
Nvidia CEO Jensen Huang, who is visiting Taiwan for two weeks, stated that the island's manufacturing sector is developing rapidly and needs more electricity.
2026-05-27
digitimes.com
2026-05-27
Nvidia held an "employee town hall" on the morning of May 27 at the T17 and T18 sites in Beitou-Shilin Technology Park (BSTP), where CEO Jensen Huang met staff, gave away Dom Pérignon, and framed Taiwan as central to the company's AI expansion. Taipei Mayor Wayne Chiang attended only as a "guest."
2026-05-27
digitimes.com
2026-05-27
China has formally brought AI chips into its national security and reliability evaluation framework for the first time, marking a further expansion of the country's Information Technology Application Innovation procurement policy into AI computing infrastructure.
2026-05-27
digitimes.com
2026-05-27
Taiwan-based Daxin Materials posted stronger revenue and profitability in 2025 as rapid growth in semiconductor materials offset a still-cautious display market recovery, with AI- and HPC-driven demand emerging as the company's primary growth engine.
2026-05-27
digitimes.com
2026-05-27
The agreement between Qualcomm and ByteDance positions the former for large-scale AI ASIC demand from the latter, as reported by Bloomberg, but market viability remains uncertain amid intense AI chip competition, evolving China procurement preferences, and regulatory pressures affecting cross-border semiconductor adoption.
2026-05-27
digitimes.com
2026-05-27
US efforts to rebuild its semiconductor supply chain are exposing a critical gap in domestic packaging and testing capacity, a bottleneck that industry sources expect to ease only after 2028 as the US OSAT ecosystem gradually takes shape.
2026-05-27
www.bloomberg.com
2026-05-27
Bloomberg.com
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2026-05-27
digitimes.com
2026-05-27
Computex 2026 is set to officially open in Taipei, and Taiwan External Trade Development Council (TAITRA) Chairman James C.F. Huang has stated that the combined market capitalization of foreign companies participating in forums and keynote sessions at this year's event exceeds US$10 trillion. He also said that TAITRA has allocated the entire Taipei International Convention Center (TICC) exclusivel
2026-05-27
digitimes.com
2026-05-27
Wah Lee Industrial said it has formally moved into investments in standard gases and other supplies needed by wafer fabs, with its Tainan logistics center set to open in the second half of 2026 to support future growth. Chairman Gary Chang also confirmed that the company will pass on higher costs for semiconductor and PCB products quarterly as raw material prices climb.
2026-05-27
digitimes.com
2026-05-27
First Micron, then SK Hynix, join the trillion-dollar club, capping an extraordinary repricing of an industry once dismissed as a commodity play. The milestone is more than a valuation story: it crystallizes a structural debate about whether AI has permanently transformed memory's earnings profile, a bubble concern as Chinese rivals ramp capacity, and a sharpening geopolitical contest over who con
2026-05-27
digitimes.com
2026-05-27
TSMC chairman and CEO C.C. Wei addressed employees at a company-wide meeting on May 27, making a direct commitment on bonuses after days of backlash over reports of a 15% cut.
2026-05-27
eetimes.com
2026-05-27
Gary Hilson
University of Saskatchewan will leverage quantum computing for health, defense, energy, and agriculture research.
2026-05-27
www.wsj.com
2026-05-27
WSJ
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2026-05-27
insurancenewsnet.com
2026-05-27
InsuranceNewsNet
insurancenewsnet.com
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2026-05-27
www.digitimes.com
2026-05-27
digitimes
SK Hynix has unveiled a new high-bandwidth memory technology designed to reduce heat buildup in next-generation AI systems, as rising computing density turns thermal management into a more critical front for HBM suppliers.
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2026-05-27
www.donga.com
2026-05-27
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2026-05-27
aijourn.com
2026-05-27
The AI Journal
BILLERICA, Mass. & TOKYO–(BUSINESS WIRE)–Entegris, Inc. (Nasdaq: ENTG), a global leader in advanced materials and purity solutions for the semiconductor industry, and JSR Corporation, a materials innovation leader and the parent company of Inpria Corporation, today announced entry into a non-exclusive cross-licensing agreement aimed at helping the semiconductor industry advance extreme ultraviolet
2026-05-27
www.gurufocus.com
2026-05-27
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