Semiconductor News & Analysis Feed

10287 articles
2026-05-29
www.investing.com 2026-05-29 Investing.com
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2026-05-29
www.fool.com 2026-05-29 The Motley Fool
At its recent I/O conference, Alphabet ( GOOGL +0.34% ) ( GOOG +0.36% ) shook up the artificial intelligence (AI) world by announcing a slew of new AI services. But one of the company's most important announcements was a new AI cloud computing company it started with venture firm Blackstone. While in its early stages, this new company could impact Nvidia's ( NVDA +0.80% ) AI hardware business and
2026-05-29
www.investing.com 2026-05-29 Investing.com
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2026-05-29
ca.investing.com 2026-05-29 Investing.com Canada
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2026-05-29
www.msn.com 2026-05-29 MSN
Samsung Electronics said Friday it has shipped the first samples of the latest high-bandwidth memory chips to its customers. The move lays down the gauntlet for Micron Technology but shouldn’t be much of an issue for the highflying stock. Samsung said it has shipped the “industry’s first 12-layer HBM4E” chips, which it said represent a more than 20% improvement in data-processing speed and a more
2026-05-29
www.pcworld.com 2026-05-29 PCWorld
FULL NERD Nvidia’s N1X could show us the future of PCs—and the bill that comes with it Nvidia’s rumored N1X chip could headline a wave of powerful new PC hardware, but rising prices may decide whether the next generation feels like progress or sticker shock. FULL NERD By Alaina Yee, Senior Editor, PCWorld MAY 29, 2026 5:00 AM PDT Image: Gordon Mah Ung / Foundry Summary created by Smart Answers AI
2026-05-29
www.barchart.com 2026-05-29 Barchart.com
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2026-05-29
finance.yahoo.com 2026-05-29 Yahoo Finance
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2026-05-29
www.ad-hoc-news.de 2026-05-29 AD HOC NEWS
Infineon’s, GaN Infineon’s GaN Patent Victory Reinforces a Rally Built on AI Infrastructure Demand 29.05.2026 - 13:43:33 | boerse-global.de US ITC bans Innoscience imports over GaN patent infringement, reinforcing Infineon's tech moat; stock up 112% YTD, targets record €16B revenue by 2026. Infineon’s GaN Patent Victory Reinforces a Rally Built on AI Infrastructure Demand - Foto: über boerse-glo
2026-05-29
tomshardware.com 2026-05-29 Aaron Klotz
Linux developers are discussing removing x32 ABI from the Linux kernel; a hybrid x32/64-bit mode that was never widely adopted by software developers.
2026-05-29
www.engineering.com 2026-05-29 Engineering.com
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2026-05-29
tomshardware.com 2026-05-29 Anton Shilov
Silicon Motion announces its SM2524XT mainstream SSD controller that promises 14 GB/s read speed, up to 2.5 million random IOPS, and sustained random performance.
2026-05-29
www.marketbeat.com 2026-05-29 MarketBeat
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2026-05-29
simplywall.st 2026-05-29 simplywall.st
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2026-05-29
seekingalpha.com 2026-05-29 Seeking Alpha
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2026-05-29
sg.finance.yahoo.com 2026-05-29 Yahoo Finance Singapore
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2026-05-29
finance.yahoo.com 2026-05-29 Yahoo Finance
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2026-05-29
www.newelectronics.co.uk 2026-05-29 New Electronics
Share LinkedIn Teams WhatsApp Facebook Email X Neil Tyler 29 May 2026 More in Automotive Power RECOMMENDED Infineon's new quad‑phase TLVR power module to meet AI data centre demands Infineon expands CoolSiC module portfolio for high-voltage applications Infineon launches €91m European project to advance sustainable power electronics Infineon introduces first silicon carbide power module o
2026-05-29
www.datacenterdynamics.com 2026-05-29 Data Center Dynamics
Enterprise cloud computing provider Nutanix's CEO, Rajiv Ramaswami, claims that the ongoing supply chain issues have led to it becoming more economical for many enterprises to turn to cloud-based bare metal servers instead of deploying on-prem. In an interview with The Register, Ramaswami explained that cloud providers' ability to bulk order hardware is enabling them to offer access to servers at
2026-05-29
finimize.com 2026-05-29 Finimize
The chip designer says it supports both TSMC’s CoWoS and Intel’s EMIB as it targets $2 billion of 2026 data center revenue. MediaTek, a Taiwanese chip designer best known for smartphone processors, says it can package custom AI data-center chips using either TSMC’s CoWoS or Intel’s EMIB, giving customers two routes to get to mass production. “Advanced packaging” is the step that connects multipl