Semiconductor News & Analysis Feed

According to a recent market analysis report by IndexBox, the micronized abrasive powders market is projected to reach $2.4 billion by 2035, primarily driven by demand from the semiconductor industry for advanced process nodes, especially those below 50nm. As semiconductor devices continue to shrink

imec, ASML, and TSMC have achieved a significant breakthrough in 2D transistor technology, demonstrating complementary n- and p-type transistors with atomically thin channels on a 300mm wafer at a 50nm contacted poly pitch. Presented at the IEEE/JSAP Symposium on VLSI Technology and Circuits, the wo

ASML, TSMC, and imec have achieved scalable 2D transistor manufacturing on 300mm wafers with a 50nm pitch, marking a significant step toward industrial adoption of post-silicon logic devices. Presented at the 2026 IEEE/JSAP VLSI Symposium, the demonstration features both nFETs and pFETs using a CMOS