www.automotiveworld.com
2026-06-09
Automotive World
QDPAK's top-side thermal path allows the PCB and semiconductor domains to be managed separately, unlocking more power in less space
June 9, 2026
Nexperia has launched 1200 V silicon carbide (SiC) MOSFETs in QDPAK packaging for electric vehicle (EV) and industrial power conversion, enabling up to 3 kW more output power than conventional D2PAK-7 devices at comparable thermal limits. The portfolio