TSMC is reportedly hiking prices for 'all advanced nodes,' accounting for 74% of the company’s wafer business

Taiwan Semiconductor Manufacturing Company (TSMC) is reportedly implementing price hikes across all its advanced node processes, covering 74% of its wafer business. According to a Culpium report, the ... Read original →

TSMC’s broad-based price hikes across advanced nodes signal a structural shift in wafer pricing dynamics. Technically, including 7nm—a workhorse for AI and mobile SoCs—in the increase forces chip designers to adopt chiplet architectures or aggressive power optimization to offset costs, while EUV-intensive 3nm/2nm nodes amplify cost pressure upstream. Compliance-wise, overseas fab expansions in Arizona and Kumamoto inflate operating expenses amid tightening U.S. export controls, compelling clients to reassess supply chain resilience. Competitively, Samsung and Intel’s aggressive subsidies lack traction due to yield and capacity constraints, leaving TSMC dominant in high-performance computing. Over the next 18 months, two long-tail effects will emerge: AI chipmakers will increasingly lock in capacity via take-or-pay deals, while Chinese foundries accelerate non-U.S.-tool-based 7nm-class alternatives—though still lagging in performance-per-watt.