Industry Analysis
Surging demand from AI and EVs is triggering a cascade across the semiconductor stack: while sub-3nm scaling hits EUV lithography limits, chiplet-based heterogeneous integration and advanced packaging—exemplified by TSMC (Taiwan, China)'s strained CoWoS capacity—have become the de facto workaround. Geopolitical mandates like the U.S. CHIPS Act and EU Chips Act inflate compliance costs, forcing Samsung and Intel into capital-intensive, redundant fab builds that risk yield delays. Competitive dynamics now hinge on ecosystem control: NVIDIA dominates data centers via AI accelerators, while Qualcomm and AMD target automotive electronics through edge-AI chips to bypass legacy automotive certification hurdles. Over the next 18 months, a structural bifurcation will emerge—firms with advanced packaging and localized manufacturing will capture premium margins, while mature-node players face brutal price erosion.
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